Conductive Support Structure for Reflow Gas Venting in Stacked Circuits
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Solution Overview
Problem
As electronic devices increase in weight, the distance between them decreases, making it difficult to form conductive materials for electrical connections, leading to issues with gas venting during the reflow process.
Innovation Solution
The electronic device includes a supporting structure with conductive structures that extend from one pad to another, creating a space for gas venting and ensuring effective electrical connections by maintaining a sufficient distance between the pads despite the weight of the power module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If devices are stacked closer together to increase density, then space utilization improves, but gas venting during reflow becomes difficult
Solution Approach 1:
The supporting structure is segmented into multiple conductive structures (e.g., conductive pillars or traces) that are distributed across the pad area. This segmentation creates multiple discrete pathways for gas to escape during reflow, solving the gas venting problem while maintaining compact device spacing
Solution Approach 2:
The conductive structures serve as an intermediary element between the pads, performing dual functions: establishing electrical connection and providing gas venting pathways. This intermediary structure resolves the contradiction by mediating between the need for close spacing and the need for gas escape
2Reliability
If conductive layer thickness is increased to ensure electrical connection, then electrical conductivity improves, but void formation increases
Solution Approach 1:
The conductive structures are formed in advance with specific geometric features (such as tapered shapes or controlled thickness profiles) that facilitate proper conductive material flow during reflow. This preliminary structuring prevents void formation while ensuring adequate electrical connection
Solution Approach 2:
The geometry of conductive structures is optimized by changing parameters such as height, width, and distribution pattern. These parameter adjustments control the flow of conductive material, reducing void formation while maintaining electrical conductivity
3Length of stationary object
If distance between pads is reduced to increase device density, then space efficiency improves, but conductive material formation becomes difficult
Solution Approach 1:
Instead of relying solely on horizontal pad spacing, the solution extends the electrical connection into the vertical dimension using conductive pillars or elevated trace structures. This dimensional transition allows adequate conductive material formation space while maintaining close horizontal pad spacing for high density
Data Source
AI summary
An electronic device is provided. The electronic device includes a first circuit structure, a second circuit structure, a conductive layer, and a supporting structure. The conductive layer is disposed between the first circuit structure and the second circuit structure. The supporting structure is at least partially covered by the conductive layer and defines a space configured to vent gas