Conductive-Surface Atomic Chip for Three-Axis Ultracold-Atom Sensing
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Solution Overview
Problem
Existing ultracold atom inertial sensors, such as those described in WO2017089489, are limited to measuring angular velocity along a single axis and require complex, bulky setups for measuring along three axes, which complicates the chip design and reduces precision due to time drift and the need for multiple conductive wires.
Innovation Solution
A simplified atomic chip design with symmetrically arranged waveguides and conductive wires allows for the measurement of angular velocity along three perpendicular axes (X, Y, and Z) by using a single chip, enhancing sensitivity and reducing complexity through a reconfigurable setup with microwave and direct current control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple separate chips are used to measure angular velocity along three axes, then measurement capability along multiple axes is improved, but device complexity and volume increase
Solution Approach 1:
The patent combines three separate single-axis measurement chips into a single integrated three-axis measurement chip. The conductive wires are arranged in a matrix pattern with first conductive wires extending in a first direction and second conductive wires extending in a second direction perpendicular to the first direction, allowing the same chip structure to perform measurements along three perpendicular axes simultaneously, thereby reducing device volume and complexity while maintaining multi-axis measurement capability
Solution Approach 2:
The conductive wire matrix structure serves multiple functions: it generates magnetic fields for trapping atoms in different spatial regions, enables measurement along multiple axes through different wire combinations, and allows reconfiguration for different measurement modes. The same physical structure performs what would traditionally require three separate dedicated chips
2Adaptability or versatility
If multiple conductive wires are used for three-axis measurement, then measurement versatility is improved, but time drift and precision deteriorate
Solution Approach 1:
The measurement process is divided into sequential steps where different combinations of conductive wires are activated at different times to measure different axes. The matrix arrangement allows selective activation of wire pairs, enabling time-multiplexed measurement along three axes while using the same physical infrastructure, thereby reducing time drift compared to simultaneous multi-axis measurement systems
Solution Approach 2:
The system dynamically reconfigures which conductive wires are active at different measurement intervals. By switching between different wire combinations sequentially rather than maintaining all wires active simultaneously, the system reduces electromagnetic interference and time drift effects while maintaining the capability to measure along multiple axes
3Device complexity
If a single chip is used for three-axis measurement, then device complexity is reduced, but measurement precision and sensitivity worsen
Solution Approach 1:
Different regions of the conductive wire matrix are optimized for different measurement functions. The matrix arrangement allows local activation of specific wire pairs for specific axis measurements, enabling high-precision local measurements to be combined into comprehensive multi-axis measurement capability, thereby maintaining precision while using a unified chip structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The new chip design enables efficient and precise measurement of angular velocity along multiple axes, improving sensitivity and reducing the complexity and cost associated with multi-axis measurements.
Implementation Method 1
a first conductive wire adapted to be crossed by a direct current
Implementation Method 2
means adapted to generate a first ultracold atom trap T1 and a second ultracold atom trap T2, a trap making it possible to immobilize a cloud of ultracold atoms
Implementation Method 3
a first waveguide CPW1 and a second waveguide CPW2 adapted to the propagation of microwaves
Implementation Method 4
The waveguides are connected to at least one microwave frequency voltage or current generator
Implementation Method 5
Rotation measurements on this type of device are carried out by exploiting the Sagnac effect. The phase shift θ induced by the Sagnac effect between two counter-rotating matter waves
Data Source
Figure 1
Figure 2a~2c
Figure 3a~3b
AI summary
The invention relates to an atomic chip (Ach) for an ultracold atom sensor, comprising an XY measurement plane, the atomic chip comprising: - a plurality of first pairs of waveguides, - a plurality of second pairs of waveguides, the projections in the XY plane of the first pair furthest from X and of the second pair furthest from Y' forming at their intersection a parallelogram (P) with center O, - a first conducting wire (W1) having a projection in the XY plane along X or Y' or a diagonal (D1, D2) of said parallelogram, the first conducting wire being adapted to be traversed by a direct current, - said first wire having a flare so as to take the form of a surface (S) whose projection in the XY plane encompasses said parallelogram (P) and has a symmetry with respect to the point O.