Conductive Tape Grounding for Compact Electronic Device Interference
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Solution Overview
Problem
Conventional grounding structures in electronic devices are bulky and require complex metal structures, consuming more volume and not efficiently addressing electromagnetic interference.
Innovation Solution
The use of three-dimensionally conductive tape with embedded conductive fibers in adhesive, allowing for compact electrical coupling of conductive structures within electronic devices, such as shorting the touch sensor to the metal chassis and housing structures, thereby reducing electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional grounding structures are used, then electrical coupling between conductive structures is achieved, but the volume consumed is excessive and the structure becomes complex
Solution Approach 1:
The patent applies this principle by using thin flexible conductive tape instead of bulky conventional grounding structures. The tape can be wrapped around conductive structures and adhered to surfaces, providing effective electrical coupling while occupying minimal space and maintaining simple implementation.
Solution Approach 2:
The patent applies this principle by creating a composite conductive tape structure consisting of conductive fibers embedded in adhesive material. This composite design combines the electrical conductivity of metal fibers with the bonding capabilities of adhesive, enabling both electrical coupling and structural attachment functions in a single lightweight component.
2Object-affected harmful factors
If conventional grounding structures are used, then electromagnetic interference is reduced, but more volume is consumed than desired
Solution Approach 1:
The thin flexible tape provides sufficient surface area for electromagnetic shielding and interference reduction while maintaining a minimal volume footprint. The tape can be wrapped around conductive structures to create effective grounding paths without adding significant bulk to the device.
Solution Approach 2:
The conductive tape acts as an intermediary element between conductive structures, providing a flexible bridge for electrical coupling and interference mitigation. This intermediate solution replaces direct rigid metal-to-metal contact with a adaptable tape-based connection that achieves the same electromagnetic protection with reduced volume.
3Volume of moving object
If three-dimensionally conductive tape is used, then volume is minimized, but manufacturing complexity may increase
Solution Approach 1:
The conductive tape is manufactured as a composite material with conductive fibers embedded in adhesive during the adhesive manufacturing process. This integrated approach combines material synthesis and conductor embedding in a single manufacturing step, avoiding the need for separate assembly operations and maintaining ease of manufacture while achieving three-dimensional conductivity.
Solution Approach 2:
The manufacturing process utilizes parameter changes in the adhesive material (such as viscosity, temperature, or chemical state) to embed conductive fibers uniformly throughout the adhesive matrix. By controlling these parameters during manufacturing, the three-dimensional conductive network is created efficiently without complex multi-step processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively minimizes the volume required for grounding structures while efficiently mitigating electromagnetic interference by providing a compact, three-dimensional conductive pathway between conductive components in electronic devices.
Implementation Method 1
The conductive tape may include conductive fibers embedded in adhesive or other structures for providing the conductive tape with three-dimensional conductivity
Implementation Method 2
The conductive tape may include conductive fibers embedded in adhesive
Data Source
AI summary
An electronic device housing may have conductive walls and planar metal internal housing structures. A display in the electronic device may have a touch sensor layer such as an array of capacitive touch sensor electrodes. The display may have display layers in a plastic chassis structure and a metal chassis structure. A display layer may have a conductive surface. Conductive tape may be used to couple the touch sensor to the metal chassis structure and a metal radio-frequency shielding structure. Conductive tape may also be used to short the conductive surface of the display layer to the internal metal housing structure. Segments of conductive tape may run along each of the four edges of a display and may overlap at display corners. Conductive foam structures may be used to short the segments to adjacent portions of the conductive housing walls.