Layered Conductive Tape Dispensing for Space-Saving Vehicle Circuits
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Solution Overview
Problem
The increasing complexity of automotive electrical wiring poses challenges in packaging and assembling cables within limited vehicle spaces, making it difficult to connect remote components without reducing occupant or component space.
Innovation Solution
A device and method involving multiple reels and applicators apply individual tapes, including conductive and dielectric materials, in layers onto a substrate, using guide members and cutters to align and apply the tapes efficiently, allowing for compact integration of electrical circuits within vehicle panels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional cable bundling and routing methods are used, then electrical circuits can connect remote components, but the space required for wiring increases and reduces space available to occupants and other vehicle components
Solution Approach 1:
The patent transitions from three-dimensional cable routing through vehicle space to two-dimensional circuit trace patterns on flexible circuit boards. Electrical connections are established through planar conductive traces and vias on the FCBs rather than through spatial cable assemblies, fundamentally changing the dimensionality of electrical distribution and eliminating the need for bulky wire harnesses throughout the vehicle interior.
Solution Approach 2:
The patent employs flexible circuit boards as thin, flexible substrates that can be conformally mounted to vehicle body panels and trim pieces. These FCBs replace traditional rigid wire harnesses with thin, flexible electrical interconnects that can be routed along panel surfaces without occupying significant three-dimensional space, thereby reducing wiring space requirements while maintaining electrical connectivity.
2Ease of manufacture
If cable bundles are routed behind body panels and trim panels, then electrical connections can be established, but the complexity of packaging and assembling increases
Solution Approach 1:
The patent combines multiple separate cable functions into integrated circuit trace patterns on single flexible circuit board assemblies. Multiple electrical connections that would traditionally require separate cables and connectors are merged into unified conductive trace networks on the FCBs, reducing the number of discrete components and simplifying both packaging and assembly operations.
Solution Approach 2:
The patent performs electrical circuit fabrication and testing on flexible circuit boards before final vehicle assembly. The FCBs are pre-manufactured with complete circuit patterns, pre-assembled with connectors and components, and pre-tested for electrical functionality, allowing these ready-to-install modules to be quickly integrated into vehicle panels during final assembly, thereby reducing overall manufacturing complexity.
3Adaptability or versatility
If more cables are used to accommodate increased electronic components and sensors, then functional requirements are met, but the space behind body panels and trim panels is insufficient
Solution Approach 1:
The patent resolves the space conflict by transitioning from volumetric cable routing to planar circuit trace architecture. Electrical distribution for multiple electronic components and sensors is achieved through two-dimensional conductive patterns on flexible circuit boards that can be conformally mounted to panel surfaces, eliminating the need for additional three-dimensional wiring space behind body panels and trim panels.
Solution Approach 2:
The patent uses thin, flexible circuit board substrates that can be mounted directly to vehicle panel surfaces without requiring deep cavities or additional space behind trim panels. The flexible nature of these thin-film circuits allows them to conform to complex panel geometries and be routed through tight spaces that would be inaccessible to traditional cable bundles, thereby supporting increased component density within limited space constraints.
Data Source
AI summary
An apparatus for applying individual tapes in layers onto a substrate includes a plurality of reels, applicators, and a guide member. A first reel holds a first tape and a second reel holds a second tape. A first applicator includes a first pressure surface that receives the first tape from the first reel and presses the first tape in a direction toward the substrate to apply the first tape to the substrate. The second applicator includes a second pressure surface that receives the second tape from the second reel. The second pressure surface is aligned to dispense the second tape over a section of the first tape applied to the substrate and to press the second tape toward the substrate to apply the second tape over the first tape. The guide member is disposed between the reels and the applicators and aligns the first and second tapes during application.