Conductive Terminal Noise Shielding for Circuit Boards
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Solution Overview
Problem
Existing noise shielding technologies for circuit boards, such as those using flexible printed circuits, are expensive and require complex assembly processes, especially when applied to single-sided FR-1 boards, which are inexpensive but lack effective shielding solutions.
Innovation Solution
A conductive terminal, such as a ground terminal, is used to connect between circuit boards, extending over noise-generating components to provide vertical shielding, utilizing existing components like brass for high conductivity and reduced material usage, thereby creating an inexpensive and simple noise shielding configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a flexible printed circuit is used as a sub-printed wiring board for shielding, then noise shielding effect is achieved, but the cost increases significantly and assembly complexity increases
Solution Approach 1:
The patent replaces expensive flexible printed circuits with inexpensive copper foil that can be easily attached and removed. The copper foil serves as a temporary shielding layer during assembly and can be discarded or reused, eliminating the need for complex flexible circuit board manufacturing and assembly processes while maintaining effective noise shielding.
Solution Approach 2:
The patent extracts the essential shielding function from the complex flexible printed circuit structure and implements it using simple copper foil. By separating the shielding function from the structural support function, the solution uses a simple adhesive layer instead of a complex flexible circuit substrate, thereby reducing assembly complexity while maintaining shielding effectiveness.
2Object-affected harmful factors
If polyimide is used for the sub-printed wiring board, then noise shielding is achieved, but the material cost exceeds that of the FR-1 board itself
Solution Approach 1:
The patent replaces expensive polyimide material with inexpensive copper foil and adhesive. The copper foil, being a basic industrial material, costs fraction of polyimide while providing equivalent or superior electrical conductivity for shielding purposes. The simplicity of the materials allows for cost-effective implementation on budget-friendly FR-1 boards.
Solution Approach 2:
The patent changes the material parameters from high-cost polyimide to low-cost copper foil combined with adhesive. This parameter change maintains the essential electrical conductivity and shielding properties while dramatically reducing material costs, making the overall circuit board assembly more cost-effective without sacrificing noise shielding performance.
3Manufacturing precision
If holes or slits are formed in the sub-printed wiring board for component locations, then bonding without gaps is achieved, but redesign is required when component arrangement changes
Solution Approach 1:
The patent uses flexible copper foil with adhesive instead of rigid printed circuit boards with fixed cutouts. The flexible nature of the foil allows it to conform to various component arrangements without requiring pre-formed holes or slits. When component layouts change, the same copper foil can be repositioned and reattached, providing design flexibility while maintaining precise bonding coverage.
4Strength
If the sub-printed wiring board is soldered and bonded to the noise source board, then secure attachment is achieved, but the number of assembly steps increases
Solution Approach 1:
The patent merges the attachment function into a single adhesive bonding step, eliminating the need for separate soldering and bonding operations. The adhesive layer simultaneously provides mechanical attachment and electrical connectivity for noise shielding, reducing the assembly process to a single straightforward step while maintaining strong and reliable attachment between the copper foil and the FR-1 board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively shields noise between closely spaced circuit boards, reducing electromagnetic interference and temperature rise while being cost-effective and easy to assemble, without the need for extensive redesign or material deformation.
Implementation Method 1
A shield for noise in a vertical direction with respect to a board surface is generally used. For example, there is a method in which the frame of a product is deformed to function as a shield. However, the frame is thick to maintain its strength, and it is expensive to use the frame only for a shield for noise in terms of material and processing costs.
Implementation Method 2
a conductive terminal, which is in contact with a ground pattern on the first circuit board, and is arranged at a location between the circuit and the second circuit board so as to extend over the circuit
Data Source
AI summary
The electronic apparatus includes a first circuit board on which a circuit mounted, a second circuit board arranged close to the circuit on the first circuit board, and a conductive terminal, which is in contact with a ground pattern on the first circuit board, and is arranged at a location between the circuit and the second circuit board so as to extend over the circuit.