Conductive Thread Interconnect Core for Signal Integrity
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Solution Overview
Problem
Conventional microelectronic device substrates face challenges with signal integrity and impedance matching due to discontinuities, roughness, and size limitations in interconnects, such as plated through hole vias or stacked micro-vias, which lead to signal reflections and degradation.
Innovation Solution
The use of a conductive thread interconnect core with continuous, smooth, capless conductive threads made from metals like copper, aluminum, or gold, which are arranged and encapsulated within a dielectric material, eliminating the need for drilling and plating processes and allowing for smaller diameters and increased interconnect density, thereby improving impedance matching and reducing loop inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plated through hole vias or stacked micro-vias are used for interconnects, then manufacturing processes are established, but signal integrity deteriorates due to discontinuities, roughness, and impedance matching issues
Solution Approach 1:
The patent extracts the problematic drilling and plating processes from the interconnect formation method. Instead of creating vias through drilling and plating (which cause roughness and discontinuities), the invention uses pre-formed conductive threads that are placed into holes and encapsulated, eliminating the harmful drilling and plating steps while maintaining manufacturing capability.
Solution Approach 2:
The patent replaces the mechanical drilling and electrochemical plating processes with a placement and encapsulation process. Conductive threads are mechanically placed into prepared holes and then encapsulated with dielectric material, substituting the complex drilling-plating system with a simpler placement-encapsulation system that produces smoother, more continuous interconnects.
2Reliability
If conventional vias are used, then interconnect structure is established, but loop inductance increases and impedance matching deteriorates
Solution Approach 1:
The patent changes the physical parameters of the interconnect by using continuous conductive threads instead of segmented via structures. This changes the electrical parameters including reducing loop inductance and improving impedance matching, as the continuous thread structure provides better electrical characteristics compared to traditional via structures with discontinuities and rough surfaces.
Solution Approach 2:
The patent creates a composite structure by combining conductive threads with dielectric encapsulant material. This composite approach allows the conductive thread to provide excellent electrical continuity and low inductance while the dielectric material provides structural support and insulation, achieving both electrical performance and structural integrity.
3Ease of manufacture
If drilling and plating processes are used, then via formation is achieved, but manufacturing time and costs increase
Solution Approach 1:
The patent removes the time-consuming drilling and plating operations from the manufacturing process. By using pre-formed conductive threads that are simply placed and encapsulated, the invention extracts the harmful and time-consuming steps while maintaining the essential function of creating through-hole interconnects, thereby significantly reducing manufacturing time.
Solution Approach 2:
The conductive threads are prepared in advance as pre-formed components with the desired conductivity and dimensions. This preliminary preparation allows the actual interconnect formation to proceed quickly through placement and encapsulation, rather than requiring time-intensive drilling and plating operations during the substrate fabrication process.
Data Source
AI summary
A device and method of utilizing conductive thread interconnect cores. Substrates using conductive thread interconnect cores are shown. Methods of creating a conductive thread interconnect core are shown.