3D Printed Conductive Traces via Predefined Injection

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Solution Overview

Problem

Current methods for integrating conductive traces into three-dimensional manufactured structures face challenges such as low conductivity and manufacturing complexities, particularly in 3D printing, which limit the effectiveness and efficiency of conductive materials within these structures.

Innovation Solution

A method for forming three-dimensional objects with conductive traces involves generating an intermediate structure using additive or subtractive processes and injecting a conductive material with higher electrical and thermal conductivity into predefined locations, followed by curing and post-processing to create integrated intra-structure conductive traces and interconnects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive materials are integrated into three-dimensional manufactured structures using conventional methods, then the structures can achieve basic conductivity, but the conductivity is low and manufacturing complexity increases

Engineering Contradiction:
ImproveconductivityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-defining conductive trace locations within the 3D model design before manufacturing. The intermediate structure is generated with predefined locations for conductive traces, allowing the conductive material to be precisely injected only where needed. This approach achieves high conductivity in critical areas while avoiding the complexity of post-manufacturing modifications.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements local quality by injecting conductive material only at specific predefined locations within the intermediate structure, rather than throughout the entire structure. This creates localized high-conductivity regions exactly where electrical connectivity is needed, improving overall conductivity while minimizing material usage and manufacturing complexity.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If conductive traces are added after three-dimensional structure manufacturing, then the structure can be manufactured first, but the conductivity integration becomes complex and costly

Engineering Contradiction:
Improvemanufacturing easeVSAvoidconductivity integration
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent merges the conductive trace creation process with the 3D structure manufacturing process itself. By generating an intermediate structure with predefined conductive locations and then injecting conductive material during or immediately after manufacturing, the patent combines what would otherwise be separate operations into a unified process, improving both ease of manufacture and conductivity integration.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces an intermediate structure as a mediator between the 3D model design and the final conductive structure. This intermediate structure contains predefined locations that guide the conductive material injection, serving as a bridge that simplifies the manufacturing process while ensuring proper conductivity integration.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If conventional 3D printing methods are used for conductive materials, then the manufacturing process is simple, but the electrical and thermal conductivity is insufficient

Engineering Contradiction:
Improveelectrical conductivityVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent uses composite materials by combining a base material (from the 3D printing process) with a conductive material (injected into predefined locations). This creates a composite structure where the base material provides structural integrity and the injected conductive material provides high electrical and thermal conductivity, achieving superior performance without sacrificing manufacturing efficiency.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies parameter changes by transitioning the conductive material from a liquid or paste state during injection to a solidified state after injection. This phase change allows the material to be easily injected into the intermediate structure and then固化 to provide stable, high-conductivity traces, maintaining manufacturing efficiency while achieving superior conductivity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the creation of three-dimensional objects with improved conductivity, overcoming the limitations of existing methods by integrating conductive materials in a truly three-dimensional manner, resulting in structures with lower resistivity and enhanced electrical connectivity.

Implementation Method 1

the solution is cured by directing an electrical current through the solution to generate Joule heating

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS10039195B2Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures
Publication Date: 2018.07.31 META PLATFORMS INC
  • US10039195B2 patent drawing
  • US10039195B2 patent drawing
  • US10039195B2 patent drawing

AI summary

A method for forming a three-dimensional object with at least one conductive trace comprises providing an intermediate structure that is generated (e.g., additively or subtractively generated) from a first material in accordance with a model design of the three-dimensional object. The intermediate structure may have at least one predefined location for the at least one conductive trace. The model design includes the at least one predefined location. Next, the at least one conductive trace may be generated adjacent to the at least one predefined location of the intermediate structure. The at least one conductive trace may be formed of a second material that has an electrical and/or thermal conductivity that is greater than the first material.