Conductive Transfer Tessellated Cells Wearable Durability
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Solution Overview
Problem
Conductive transfers used in wearable items face challenges such as damage from repeated washing and wear-and-tear, limited flexibility, and potential damage during conventional manufacturing processes, which affect their electrical performance and usability in complex applications.
Innovation Solution
A conductive transfer design featuring a conductive layer sandwiched between non-conductive layers, with a tessellated cell pattern that reduces ink usage, enhances flexibility, and includes an adhesive layer for durability, allowing for application to textiles without compromising functionality, and incorporates a method of production involving sequential printing and curing of layers followed by application with heat and pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing processes are used, then production efficiency is maintained, but the conductive transfer suffers damage during stitching and handling
Solution Approach 1:
The conductive transfer is divided into discrete tessellated cells rather than a continuous conductive layer. This segmentation allows individual cells to tolerate damage from stitching and handling, as the electrical circuit can remain functional even if some cells are damaged. The segmented structure also enables the transfer to be stitched over without complete failure.
Solution Approach 2:
The patent applies a protective coating over the conductive transfer before it undergoes conventional manufacturing processes. This pre-applied protection cushioning layer prevents damage during stitching and handling, allowing the transfer to withstand conventional manufacturing without compromising its electrical performance.
2Reliability
If large amounts of conductive ink are used to cover large areas, then electrical performance is maintained, but the transfer becomes heavier and less flexible
Solution Approach 1:
The conductive transfer employs a tessellated cell structure that inherently reduces material usage compared to a solid continuous layer. The patterned, porous-like structure maintains electrical connectivity through the arranged cells while significantly reducing the total amount of conductive ink required, thereby decreasing weight and improving flexibility.
Solution Approach 2:
The patent combines conductive ink with a flexible substrate material to create a composite conductive transfer. This composite structure allows the transfer to maintain electrical performance with reduced conductive material while gaining enhanced flexibility and reduced weight from the substrate.
3Reliability
If the conductive transfer is made more durable through additional layers, then washability improves, but the manufacturing process becomes more complex
Solution Approach 1:
The patent combines the conductive pattern and protective encapsulation into a single integrated printing and curing process. By merging the application of conductive ink and protective coating into one manufacturing step, the system achieves improved washability without significantly increasing process complexity, as both layers are applied simultaneously rather than in separate steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tessellated pattern design improves durability, flexibility, and washability, allowing the conductive transfers to maintain functionality even with damage and supports integration into conventional textiles and manufacturing processes, enabling wider application in wearable items and complex applications.
Implementation Method 1
The conductive transfer comprises an adhesive layer which is suitable for adhering the conductive transfer to a textile
Implementation Method 2
The method comprises applying heat and/or pressure to the adhesive layer such that the conductive transfer adheres to the textile
Implementation Method 3
The method comprises applying heat and/or pressure to the adhesive layer such that the conductive transfer adheres to the textile
Data Source
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AI summary
A conductive transfer (401) for application to an article comprises first and second non-conductive layers and a conductive layer positioned between the two non-conductive layers. The conductive transfer further comprises an adhesive layer for adhering the conductive transfer to an article, such as a wearable item. The conductive layer comprises a plurality of tessellated cells (402) defined by a printed conductive ink. The conductive layer comprises a main element (405) and an input track (406) with the plurality of tessellated cells being comprised over the input track of said conductive layer.