Conductive Two-Fluid Nozzle for Substrate Washing
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Solution Overview
Problem
High-speed two-fluid jet washing methods often result in substrate electrification, leading to particle adhesion issues due to insufficient electrification suppression, unlike conventional methods.
Innovation Solution
A substrate washing device featuring a conductive two-fluid nozzle and a specific-resistance adjusting mechanism to control the electrification of droplets, with options for conductive or non-conductive materials and adjustable flow rates to inhibit substrate electrification during high-speed washing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-speed two-fluid jet washing is used to improve washing efficiency, then productivity is improved, but substrate electrification occurs leading to particle adhesion
Solution Approach 1:
A conductive member is introduced as an intermediary between the two-fluid nozzle and the substrate. This conductive member serves as a mediator that dissipates the electrostatic charge generated during high-speed washing, allowing the washing efficiency to be maintained while preventing substrate electrification and particle adhesion.
Solution Approach 2:
The patent replaces the conventional non-conductive nozzle structure with a conductive member that has electrical conductivity. This substitution enables the system to handle the electrostatic effects inherent in high-speed two-fluid jet washing by providing a path for charge dissipation, thus resolving the electrification problem while maintaining high washing productivity.
2Device complexity
If conventional non-conductive nozzle is used, then device complexity is low, but electrification amount of droplets increases during high-speed washing
Solution Approach 1:
A conductive member is introduced as an intermediary between the two-fluid nozzle and the substrate. This conductive member serves as a mediator that dissipates the electrostatic charge generated during high-speed washing, allowing the washing efficiency to be maintained while preventing substrate electrification and particle adhesion.
Solution Approach 2:
The patent changes the electrical conductivity parameter of the nozzle structure by introducing a conductive member. This parameter change transforms the nozzle from a non-conductive structure to one with controlled electrical conductivity, enabling effective charge dissipation during high-speed washing without significantly increasing device complexity.
3Object-affected harmful factors
If CO2 gas is mixed into pure water to suppress electrification in conventional washing, then electrification amount is suppressed, but this method is insufficient during high-speed washing
Solution Approach 1:
A conductive member is introduced as an intermediary between the two-fluid nozzle and the substrate. This conductive member serves as a mediator that dissipates the electrostatic charge generated during high-speed washing, allowing the washing efficiency to be maintained while preventing substrate electrification and particle adhesion.
Solution Approach 2:
The patent replaces the chemical method (CO2 gas mixing) with a physical/electrical solution (conductive member). This substitution provides a more effective means of suppressing electrification that is specifically tailored for high-speed washing conditions, where the conventional chemical method becomes insufficient.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses substrate electrification and prevents particle adhesion during high-speed two-fluid jet washing, ensuring a clean and efficient washing process.
Implementation Method 1
the two-fluid nozzle is formed of a conductive material
Implementation Method 2
a specific-resistance adjusting mechanism that adjusts the specific resistance value of a washing liquid to be supplied to the two-fluid nozzle
Implementation Method 3
particles, etc. on the surface of the substrate are removed (washed away) by using shock waves caused by collision of the droplets with the surface of the substrate
Data Source
AI summary
A substrate washing device includes a substrate holding mechanism 70 that holds a substrate W, a substrate rotating mechanism 72 that rotates the substrate W held by the substrate holding mechanism 70, and a two-fluid nozzle 46 that ejects a two-fluid jet toward a surface of the rotating substrate W. The two-fluid nozzle 46 is formed of a conductive material. Accordingly, the electrification amount of droplets ejected as the two-fluid jet from the two-fluid nozzle 46 can be suppressed.


