Conductive Via Isolation From Glass for Mechanical Analysis
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Solution Overview
Problem
The glass substrate interferes with the analysis of mechanical properties of conductive vias, making it difficult to test their robustness and analyze morphologies, chemical composition, and internal structure due to charge absorption and interference with testing methods.
Innovation Solution
A method is developed to remove the glass substrate surrounding conductive vias, allowing for isolated testing and analysis of the vias without interference, using techniques like laser oblation, mechanical separation, and chemical etching to create a support structure and isolate the conductive vias for compression, bending, and microstructural analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the glass substrate is kept intact to maintain structural support and electrical isolation, then the mechanical stability and electrical insulation are preserved, but the analysis of conductive via mechanical properties is interfered with due to charge absorption and testing method interference
Solution Approach 1:
The glass substrate is segmented by removing portions surrounding the conductive vias, creating isolated via structures that can be tested independently while maintaining the electrical isolation function of the glass
Solution Approach 2:
The glass substrate material is extracted and removed from around the conductive vias, separating the via structures from the bulk glass to enable mechanical property testing without glass interference
2Difficulty of detecting and measuring
If the glass substrate is removed to enable conductive via testing and analysis, then the interference with mechanical property analysis is eliminated, but the structural support and electrical isolation are compromised
Solution Approach 1:
The glass substrate is modified locally around each conductive via, removing only the necessary portions for testing while preserving the electrical isolation properties of the remaining glass structure
Solution Approach 2:
A support structure is introduced as an intermediary element to hold the isolated conductive vias during testing, replacing the structural support function of the removed glass substrate
3Measurement precision
If the entire glass substrate is removed to fully isolate conductive vias, then the analysis accuracy is maximized, but the loss of structural context and increased device complexity occurs
Solution Approach 1:
Only the necessary portions of the glass substrate are removed - enough to isolate the vias for testing but not so much as to remove all structural context or require complex replacement structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate testing and analysis of conductive vias without glass substrate interference, allowing for comprehensive characterization of their mechanical properties and microstructure, facilitating the evaluation of their robustness and internal structure.
Implementation Method 1
forming a support layer over at least one surface of the glass substrate and an exposed surface of a conductor of each conductive via
Implementation Method 2
using techniques like laser oblation, mechanical separation, and chemical etching to create a support structure and isolate the conductive vias
Implementation Method 3
using techniques like laser oblation, mechanical separation, and chemical etching to create a support structure and isolate the conductive vias
Data Source
AI summary
A method for isolating at least one conductive via from a surrounding glass substrate is provided. A support layer is formed over at least one surface of the glass substrate. Thereafter, the glass substrate is removed. As a result, the at least one conductive via can be analyzed without interference from the glass substrate.