Conductive Via Formation for 3D Dielectric Layer Interconnection
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Solution Overview
Problem
The challenge in the electronic industry is to create a method for forming conductive vias that enable effective electrical communication between stacked layers in three-dimensional structures, as existing technologies struggle to achieve high integration density and efficient electrical connectivity in miniaturized electronic components.
Innovation Solution
A method involving the preparation of a dielectric layer, followed by forming a connection via through mechanical drilling, sand-blasting, or laser drilling, and subsequent electroplating to create a connection electrode and extraction electrodes, ensuring electrical connectivity between layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical drilling, sand-blasting, or laser drilling is used to form connection vias, then the electrical connectivity between stacked layers is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent segments the via formation process into multiple independent steps: drilling the connection via through the dielectric layer, forming the connection electrode within the via, and separately forming extraction electrodes on the surfaces. This segmentation allows each step to be optimized independently while maintaining overall system reliability.
Solution Approach 2:
The patent transitions from planar (2D) electrode arrangements to three-dimensional stacked structures with vertical connection vias. This dimensional change enables electrical connectivity through multiple layers, significantly improving integration density and connectivity options while managing the complexity through systematic process design.
2Adaptability or versatility
If multiple drilling processes (mechanical, sand-blasting, laser) are employed, then the versatility of via formation is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent employs different drilling processes (mechanical, sand-blasting, laser) by changing key process parameters such as drilling method, material removal mechanism, and equipment type. Each process is selected based on specific requirements for via dimensions, depth, and dielectric material properties, allowing versatile via formation while maintaining precision through parameter optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the formation of conductive vias that facilitate efficient electrical communication between stacked layers, enhancing integration density and connectivity in miniaturized electronic components, such as inductors and capacitors.
Implementation Method 1
forming high-speed injection beams through a sand-blasting process by using compressed air as power in combination with solid abrasive particles or liquid mixed with the solid abrasive particles
Implementation Method 2
vertically irradiating a laser onto a first surface or a second surface of the dielectric layer by means of a laser device, thereby forming the connection via
Implementation Method 3
forming a connection electrode in the connection via, forming a first extraction electrode on the first surface, and forming a second extraction electrode on the second surface
Data Source
AI summary
The present disclosure provides a method for forming a conductive via, and belongs to the technical field of electronic elements. The present method includes: preparing a dielectric layer, and forming a connection via, which extends through the dielectric layer in a thickness direction of the dielectric layer, in the dielectric layer; wherein the dielectric layer includes a first surface and a second surface oppositely arranged in the thickness direction of the dielectric layer; forming a connection electrode in the connection via, forming a first extraction electrode on the first surface, and forming a second extraction electrode on the second surface; wherein the connection electrode at least covers an inner wall of the connection via, and the first extraction electrode and the second extraction electrode are electrically connected to the connection electrode.