Conductive Wire Housing Path for Image Forming Apparatus

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Solution Overview

Problem

Existing image forming apparatuses face challenges in forming a high-voltage power supplying path efficiently and reducing size, as they often require complex internal wiring and additional space for power connections, which complicates maintenance and increases costs.

Innovation Solution

The apparatus features a conductive wire material forming a high-voltage power supplying path on the outer surface of the housing, which applies a pressing force to the transferring unit and positions it correctly, ensuring stable contact and reducing the need for internal wiring, thus enabling size reduction and cost optimization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the power supplying path is provided inside the housing, then the high-voltage power supply is stable, but the apparatus size increases and manufacturing becomes complex

Engineering Contradiction:
Improvehigh-voltage power supply stabilityVSAvoidapparatus size
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The power supplying path is moved from the internal three-dimensional space to the external two-dimensional surface of the housing. The conductive wire material is disposed along the outer surface of the housing to form the power supplying path, allowing high-voltage power to be supplied to the imaging portion and transferring unit without occupying internal space, thus reducing apparatus size while maintaining power supply stability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Instead of providing complex internal wiring, the patent uses a simple conductive wire material traced along the housing surface to create the power supplying path. This simplified representation of the power path reduces manufacturing complexity and apparatus size while maintaining the essential function of high-voltage power delivery.

Inventive Principle:
Principle #26Copying

2Reliability

If complex internal wiring is used for power supply, then power delivery is reliable, but maintenance difficulty and cost increase

Engineering Contradiction:
Improvepower delivery reliabilityVSAvoidmaintenance difficulty
Core Design Contradiction:
ReliabilityVSEase of repair

Solution Approach 1:

The power supplying path is extracted from the internal wiring system and placed on the external housing surface. This allows the conductive wire material to be easily accessed, inspected, and replaced without disassembling the apparatus, significantly improving maintenance ease while maintaining power delivery reliability through the direct external connection.

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If additional space is allocated for internal power connections, then power supply stability is ensured, but device complexity and cost increase

Engineering Contradiction:
Improvepower supply stabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The housing surface serves multiple functions: it provides structural support, electrical insulation, and a pathway for the conductive wire material to form the power supplying path. This multi-functional use of the housing eliminates the need for separate internal power connection structures, reducing device complexity while ensuring power supply stability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for a more straightforward and stable high-voltage power supply, enhances the positioning of the transferring unit, and prevents power leakage, resulting in a more compact and cost-effective image forming apparatus.

Implementation Method 1

a power supplying path that is formed on an outer surface of the housing so that the high voltage is supplied from the high-voltage power supplying unit to the imaging portion and the transferring unit via the power supplying path

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

the conductive wire material is disposed, along the outer surface of the housing, so that a force is applied in a direction that enhances a condition of the transferring unit being pressed against the image holding member

Methodology Applied
Scientific EffectMechanical force: Mechanical Force

Data Source

PatentEP2230569B1Image forming apparatus
Publication Date: 2014.08.27 FUJIFILM BUSINESS INNOVATION CORP
  • EP2230569B1 patent drawingFigure 1
  • EP2230569B1 patent drawingFigure 2
  • EP2230569B1 patent drawingFigure 3

AI summary

An image forming apparatus comprises: a housing that is fixedly placed in the image forming apparatus and integrally accommodates an imaging portion that includes at least an image holding member; a transferring unit that is disposed against the image holding member so that the transferring unit is capable of pressing and separating the image holding member; and a high-voltage power supplying unit that supplies a high voltage, wherein a power supplying path that is formed on an outer surface of the housing so that the high voltage is supplied from the high-voltage power supplying unit to the imaging portion and the transferring unit via the power supplying path.