Conductive Wire LED Interconnection for Flexible Routing
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Solution Overview
Problem
Current methods for routing conductive tracks on printed circuits for LED devices are limited by pattern complexity, conductivity, and heat dissipation, leading to inefficiencies and increased costs, particularly in flexible and large surface applications.
Innovation Solution
The use of conductive wires secured to a support, either by embedding them in the thickness or bonding them to the surface, allows for flexible routing patterns and improved heat dissipation through modular thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conductive tracks are formed by chemical etching or mechanical cutting of conductive film, then the routing pattern is limited, but the conductivity and manufacturing precision are maintained
Solution Approach 1:
The patent replaces chemical etching and mechanical cutting processes with a direct wire bonding approach. Conductive wires are directly bonded to the support and routed to connect LED devices, eliminating the need for complex film processing steps while achieving flexible routing patterns and high conductivity.
Solution Approach 2:
The invention changes the fundamental parameter of conductive track formation from indirect film-based methods to direct wire-based methods. This parameter change enables arbitrary routing patterns, overlapping tracks, and large surface coverage while maintaining excellent electrical conductivity and simplifying the manufacturing process.
2Adaptability or versatility
If conductive ink is printed on the support to form tracks, then the routing flexibility is improved, but the conductivity and track density are reduced
Solution Approach 1:
The patent substitutes conductive ink printing with direct wire bonding. Physical conductive wires are bonded directly to the support and routed to connect LED devices, providing superior electrical conductivity compared to printed ink while maintaining routing flexibility through wire routing rather than printing constraints.
3Ease of manufacture
If conventional routing methods are used, then the manufacturing process is simple, but the heat dissipation capability is insufficient for high current LED chips
Solution Approach 1:
The conductive wires serve multiple functions simultaneously: electrical interconnection, heat dissipation, and structural support. The wires are routed to connect LED devices while also providing thermal pathways to heat sinks or heat-dissipating structures, eliminating the need for separate thermal management components and simplifying the overall manufacturing process.
4Stability of the object's composition
If LED devices are mounted on rigid printed circuits, then the structural stability is maintained, but the adaptability to flexible applications is lost
Solution Approach 1:
The patent employs a flexible support substrate that can be deformed while maintaining the integrity of the wire-bonded conductive tracks and LED device connections. The flexible support allows the entire assembly to be bent or deformed for flexible applications while the wire bonds and adhesive connections maintain structural stability during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables higher density and flexibility in LED interconnections, reduced bulk, and effective heat dissipation, enabling more efficient and cost-effective LED device assemblies on flexible or rigid supports.
Implementation Method 1
The conductive wires are calibrated according to their use. For example, these conductive wires can be intended for the power supply of the LED device or devices, for the electrical interconnection of an LED device with other LED devices or with other components
Implementation Method 2
Another major problem with PCB-mounted LED devices is the removal of heat generated by the LED. Poor heat dissipation can lead to premature aging of components and a drop in system efficiency.
Data Source
Figure 1~2
Figure 3A~4
Figure 5A~5B
AI summary
A device for emitting light radiation comprising: at least one LED device (3) able to generate light radiation in a predefined wavelength range and comprising two electrical contact lands (30, 31); a carrier (1) bounded by first and second opposite faces (10, 11) defining therebetween a thickness of the carrier (1), said carrier (1) bearing at least the light-generating LED device (3) and at least one electrically conductive track. According to the invention, the electrical track is composed of conductive wires (2), all or a portion of the conductive wires (2) being securely fastened to the carrier (1) over all or a portion of their length (1), all or a portion of the conductive wires having at least one contact section (20) that is exposed in the direction of at least one of the first and second faces of the carrier (1). Moreover, each of the contact lands (30, 31) of the LED device (3) is positioned facing a contact section (20) of one of the conductive wires (2) and is electrically connected to said contact section (20).