Conductor Built-in Ceramic Molding Process
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Solution Overview
Problem
Existing methods for producing conductor built-in ceramics face challenges such as difficulty in creating complex shapes, deformation of metallic members, incorporation of foreign substances during sintering, and issues with dielectric breakdown and cracking.
Innovation Solution
The process involves forming a conduction compact using an electroconductive ceramic powder and binder, then coating it with an insulating ceramic powder and binder mixture within a mold to prevent gaps and foreign substances, followed by dewaxing and sintering to create a stable conductor built-in ceramic with optimized shape and properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uniaxial pressing treatment is adopted to form a precursor, then the metallic member can be positioned between pre-molded products, but it becomes difficult to produce products having complicated shapes and the metallic member may deform
Solution Approach 1:
The invention divides the forming process into two independent stages: first forming the insulating ceramic molded product, then separately forming the conductor compact with metallic member and bonding them together. This segmentation allows each component to be optimized independently, enabling complex shapes in the ceramic while maintaining metallic member integrity without deformation during forming.
2Ease of manufacture
If paste is printed to form the energization part, then the electrode can be formed on ceramic molded product, but the printed paste tends to bleed or become uneven
Solution Approach 1:
The invention replaces the paste printing process with a molding process where a conductor mixture (containing ceramic powder and binder) is molded into a conductor compact with the metallic member already embedded. This mechanical molding substitution eliminates the bleeding and unevenness issues inherent in paste printing, achieving uniform electrode formation through controlled compacting.
3Ease of manufacture
If ceramic molded products are superimposed and sintered together, then the ceramic structure can be formed, but foreign substances and dust are incorporated into the interface between products
Solution Approach 1:
The invention merges the conductor compact formation with the metallic member positioning into a single integrated process step. The conductor mixture is molded directly around the metallic member to form the conductor compact, which is then bonded to the insulating ceramic molded product. This merging eliminates the separate superimposition and sintering steps that cause interface contamination, achieving a clean bonded interface without foreign substance incorporation.
4Reliability
If metallic lead wire is used in the energization part, then electrical conduction can be achieved, but bending and cutting of wire rod is required
Solution Approach 1:
The invention uses a composite conductor mixture consisting of electroconductive ceramic powder and binder material instead of metallic lead wire. This composite material provides the necessary electrical conduction while being formable into complex shapes through molding, eliminating the need for bending and cutting operations. The conductor compact is directly molded with the desired shape and metallic member integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method suppresses deformation, cracking, and dielectric breakdown, allowing for the production of conductor built-in ceramics with improved electrical insulation and strength, suitable for complex shapes and applications like ceramic heaters.
Implementation Method 1
wherein the element compact is subjected to a dewaxing treatment
Implementation Method 2
a sintering treatment, thereby a sintered body can be obtained
Data Source
AI summary
[PROBLEMS] To provide a process for producing a conductor built-in ceramic which can eliminate the need to conduct metallic lead wire processing, can suppress the entry of a foreign matter, dust and the like from gaps between bases formed in dewaxing and firing and can reduce a dielectric breakdown failure, and a conductor built-in ceramic produced by the production process. [MEANS FOR SOLVING PROBLEMS] A process for producing a conductor built-in ceramic, comprising the step of producing a molded product (11) for an energization part using a conduction mixture, containing an electroconductive ceramic powder and a binder, the step of holding the molded product (11) for an energization part within a mold (13) and filling a mixture (15), for a base, containing an insulating ceramic powder and a binder into the mold (13) to produce an element compact (17) comprising a molded product (11), for an energization part, covered with the mixture (15) for a base, and the step of firing the element compact (17). According to the production process, the formation of gaps between the energization part and the base can be suppressed, and external inclusion of a foreign material, dust and the like in the element compact (17) in dewaxing or firing can also be suppressed.