Conductor Connecting Structure for Fine Pitch Soldering
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Solution Overview
Problem
Conventional conductor connecting structures face challenges in connecting fine electrical wires to substrates with narrow pitch connection pads, as the arrangement of connection terminals and insulating coatings limit the ability to reduce the pitch, making it difficult to reliably connect multiple fine wires to substrates like ASICs.
Innovation Solution
A conductor connecting structure with a connection pad that includes a solder storing part extending beyond the front end of the core wire, allowing for reliable soldering of fine electrical wires by providing a stable solder supply and preventing solder bridging between adjacent pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection terminals are arranged in electrical wire securing grooves between protrusions, then solder can be contained and adjacent wires/terminals do not short circuit, but the pitch of connection terminals cannot be reduced
Solution Approach 1:
The invention changes the spatial arrangement from a planar groove-based containment to a three-dimensional structure where the connection terminal itself forms a protrusion with an integrated solder containing portion. This vertical dimensionality allows solder to be contained on the front surface of the terminal rather than requiring a groove, enabling pitch reduction while maintaining short circuit prevention.
Solution Approach 2:
The invention merges the connection terminal and the solder containing structure into a single integrated component. The solder containing portion is formed as an integral part of the connection terminal's front surface, eliminating the need for separate grooves or protrusions, thereby reducing the overall pitch while maintaining reliability.
2Productivity
If fine electrical wires are connected to fine connection pads at narrow pitch, then substrate integration is improved, but reliable connection becomes difficult due to limited solder supply control
Solution Approach 1:
The invention performs preliminary action by pre-forming a solder containing portion on the front surface of the connection terminal before the soldering process. This allows solder to be pre-positioned and controlled in the exact location where it is needed, ensuring reliable connection of fine wires to fine pads at narrow pitches by preventing both solder deficiency and excessive solder spread.
3Reliability
If solder is provided in electrical wire securing grooves, then core wires are connected to connection terminals, but pitch reduction is limited due to groove structure requirements
Solution Approach 1:
The invention extracts the solder containment function from the groove structure and relocates it to the front surface of the connection terminal itself. This separation of functions allows the groove to be eliminated or minimized, enabling pitch reduction while maintaining the solder containment capability necessary for reliable connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables reliable connection of multiple fine electrical wires to fine connection pads at narrow pitches, enhancing the reliability and preventing solder bridging, even in cases of positional deviations, by ensuring a sufficient solder supply and using solder resist or insulation films to prevent short circuits.
Implementation Method 1
the core wire is connected to an upper surface of the connection pad through soldering
Implementation Method 2
a coating film of a solder resist is formed between the connection pads adjacent on an upper surface of the substrate
Data Source
AI summary
The present disclosure provides a conductor connecting structure that connects a cable to a substrate, where the substrate includes at least one connection pad, the cable includes at least one core wire, the core wire is connected to an upper surface of the connection pad through soldering, and the connection pad includes a solder storing part that is present further frontward than a front end of the core wire.