Conductor-Insulator Electronic Assembly for Warpage Reliability
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Solution Overview
Problem
Current electronic devices face structural reliability issues due to the mismatch in thermal expansion coefficients between substrates and conductive layers, leading to warpage during high-temperature processes.
Innovation Solution
The electronic device design includes a substrate with a first conductor layer, a first insulating layer, and an electronic component, where the electronic component is disposed on the insulating layer and coupled to the conductor layer, and the driving structure is coupled to the electronic component, allowing for improved structural reliability by reducing warpage caused by high-temperature processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the driving structure is fabricated on the substrate, then the electronic device can be assembled, but the substrate will warp due to thermal expansion mismatch during high-temperature processes
Solution Approach 1:
The patent introduces an intermediate layer between the substrate and the driving structure to act as a buffer that absorbs thermal expansion differences. This intermediary layer prevents direct thermal stress transmission, allowing the driving structure to be fabricated while minimizing substrate warpage during high-temperature processes.
Solution Approach 2:
The patent employs composite material structures that combine materials with different thermal expansion coefficients in a layered configuration. This composite approach allows the overall structure to accommodate thermal stress through controlled differential expansion, maintaining structural integrity during manufacturing and operation.
2Device complexity
If the driving structure is directly fabricated on the substrate, then the device structure is simple, but warpage occurs during high-temperature processes affecting structural reliability
Solution Approach 1:
The patent addresses substrate flatness issues by introducing additional layers in the vertical dimension rather than complicating the horizontal layout. This dimensional approach allows thermal management and stress distribution without increasing planar device complexity, maintaining manufacturing precision while preserving structural simplicity.
3Ease of manufacture
If conventional fabrication processes are used, then the manufacturing process is straightforward, but thermal expansion mismatch causes substrate warpage
Solution Approach 1:
The patent modifies fabrication process parameters, particularly temperature profiles and processing sequences, to minimize thermal stress accumulation. By carefully controlling heating and cooling rates during manufacturing, the substrate maintains its integrity throughout the fabrication process while allowing straightforward manufacturing procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the structural reliability of electronic devices by minimizing warpage and maintaining the integrity of the device structure during fabrication and operation.
Implementation Method 1
The first insulating layer is disposed on the first conductor layer
Implementation Method 2
the thermal expansion coefficient of a substrate is very different from the thermal expansion coefficient of a conductive layer. Therefore, when a driving structure is fabricated on the substrate, the substrate will warp due to the high-temperature process
Data Source
AI summary
The disclosure provides an electronic device, including a substrate, a first conductor layer, a first insulating layer, an electronic component, and a driving structure. The first conductor layer is arranged on the substrate. The first insulating layer is disposed on the first conductor layer. The electronic component is arranged on the first insulating layer and coupled to the first conductor layer. The driving structure is coupled to the electronic component. The electronic device in the disclosure can have improved structural reliability.