Multi-Level Conductor Layer Packaging for Heat and Signal Transfer
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Solution Overview
Problem
The challenge of integrating smaller electronic devices with improved signal transmission and heat dissipation effects has not been adequately addressed, particularly in the design of circuit layers within these devices.
Innovation Solution
The electronic device incorporates a semiconductor package structure with specific conductor layer heights and ratios, including a chip, insulating layers, and conductor layers with defined openings and connections to enhance heat dissipation and signal transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the circuit layer is designed with conventional conductor layer configurations, then the device integration is achieved, but the heat dissipation effect is insufficient and heat accumulation occurs
Solution Approach 1:
The circuit layer is divided into multiple conductor layers (first conductor layer, second conductor layer, third conductor layer) with different heights and functions. Each conductor layer is segmented into multiple conductor patterns arranged in different directions, creating a multi-level segmented structure that enhances heat dissipation surface area and improves thermal management while maintaining device integration
Solution Approach 2:
The patent introduces a vertical dimension by creating conductor layers at different heights (first height, second height, third height) within the circuit layer. This multi-level three-dimensional configuration transforms the conventional planar circuit structure into a vertical stacked architecture, increasing heat dissipation efficiency without expanding the device footprint
2Reliability
If the conductor layers are configured with equal heights for simplicity, then the manufacturing process is easier, but the signal transmission effect is suboptimal due to resistance issues
Solution Approach 1:
The patent specifies precise parameter ranges for conductor layer heights, where the first conductor layer has a first height, the second conductor layer has a second height, and the third conductor layer has a third height, with the ratio of first height to second height being greater than or equal to 0.1 and less than or equal to 0.9. This parameter optimization balances signal transmission performance with manufacturing feasibility
3Productivity
If more components are integrated into smaller electronic devices, then the device functionality is enhanced, but the heat accumulation problem worsens
Solution Approach 1:
The circuit layer is divided into multiple conductor layers (first conductor layer, second conductor layer, third conductor layer) with different heights and functions. Each conductor layer is segmented into multiple conductor patterns arranged in different directions, creating a multi-level segmented structure that enhances heat dissipation surface area and improves thermal management while maintaining device integration
Solution Approach 2:
The patent introduces a vertical dimension by creating conductor layers at different heights (first height, second height, third height) within the circuit layer. This multi-level three-dimensional configuration transforms the conventional planar circuit structure into a vertical stacked architecture, increasing heat dissipation efficiency without expanding the device footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation by reducing heat accumulation and enhances signal transmission through optimized conductor layer configurations, ensuring better electrical connections and reduced resistance.
Implementation Method 1
The first conductor layer is disposed in the first opening. The circuit layer includes a second opening and a second conductor layer disposed in the second opening. The bonding pad is in contact with the second conductor layer, and the bonding pad is electrically connected to electronic unit
Implementation Method 2
the effect of heat dissipation affects the performance of the electronic device. Therefore, how to provide good signal transmission effect and good heat dissipation effect at the same time is an issue that needs further improvement
Data Source
AI summary
An electronic device includes an electronic unit, a circuit layer and a bonding pad. The electronic unit includes a chip, an insulating layer and a first conductor layer. The insulating layer is disposed on the chip, the insulating layer includes a first opening, and the first conductor layer is disposed in the first opening. The circuit layer is disposed corresponding to the electronic unit, and the circuit layer includes a second opening and a second conductor layer disposed in the second opening. The bonding pad is in contact with the second conductor layer, and the bonding pad is electrically connected to electronic unit. The first conductor layer has a first height, the second conductor layer has a second height, and a ratio of the first height to the second height is greater than or equal to 0.1 and less than or equal to 0.9.