Semiconductor Conductor Lines Overlapping Contact Pads
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Solution Overview
Problem
Current wafer level packaging technologies face limitations in routing density due to design constraints, necessitating advancements in conductor line distribution and external contact pad configurations to enhance packaging efficiency.
Innovation Solution
The implementation of a method involving multiple metallization layers and the strategic placement of external contact pads overlapping conductor lines, allowing for increased routing density by extending the redistribution layer beyond the semiconductor chip outline through the use of electrically insulating materials and advanced manufacturing processes such as galvanic deposition and lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductor lines are routed within the semiconductor chip outline, then manufacturing is simpler, but routing density is limited
Solution Approach 1:
The patent extends conductor lines from the traditional planar routing within the chip outline into the third dimension by allowing them to protrude beyond the chip outline and be embedded in the substrate. This dimensional extension enables additional routing paths that were previously unavailable, thereby increasing routing density without complicating the manufacturing process
2Ease of manufacture
If external contact pads are placed far apart, then manufacturing is easier, but package area increases
Solution Approach 1:
The patent embeds the protruding conductor lines and external contact pads within the substrate, creating a nested structure where the redistribution layer is contained within the substrate volume. This nesting allows contact pads to be positioned closer together while maintaining manufacturing feasibility, thereby reducing the overall package area
3Quantity of substance
If conductor lines are extended beyond chip outline, then routing density increases, but manufacturing complexity increases
Solution Approach 1:
The patent forms the protruding conductor lines and external contact pads as part of the redistribution layer before substrate mounting. This preliminary formation of the extended conductor structure allows subsequent substrate embedding and contact pad placement to proceed using standard manufacturing processes, thereby increasing routing density without proportionally increasing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases routing density, enabling more efficient packaging with relaxed constraints on pad size and pitch, thereby facilitating improved second-level assembly and reducing production costs while maintaining compact package dimensions.
Implementation Method 1
advanced manufacturing processes such as galvanic deposition and lamination
Implementation Method 2
advanced manufacturing processes such as galvanic deposition and lamination
Data Source
AI summary
A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact pad is placed over the first conductor line. At least a portion of the first conductor line lies within a projection of the external contact pad on the semiconductor chip.