Conductor Post Wiring Board Heat Dissipation
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Solution Overview
Problem
Existing semiconductor devices face challenges in maintaining stable electric connection and heat dissipation, especially in power system circuits with large power handling, where noise reduction and durability against repetitive heat cycles are crucial, and existing solutions do not adequately address these issues.
Innovation Solution
The semiconductor device employs wiring boards with insulating boards, conductor circuits, and through-holes, along with conductor posts having flange, head, and leg portions, where the conductor posts are inserted into the through-holes to establish electrical connections and provide a heat dissipation mechanism, and electronic components are connected to the leg portions for improved reliability and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal base plate is provided on the bottom surface of the insulating board to improve heat dissipation, then heat dissipation effect is improved, but device complexity increases
Solution Approach 1:
The patent combines the heat dissipation function with the existing insulating board structure by providing a heat dissipation plate on the bottom surface of the insulating board. This merges the thermal management function into the structural component, avoiding additional separate heat dissipation mechanisms and reducing overall device complexity while improving heat dissipation effect.
2Reliability
If conductor posts with flange portions are inserted into through-holes to improve electrical connection stability, then electrical connection reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The flange portion of the conductor post acts as a pre-positioning and cushioning structure that prevents misalignment and ensures proper seating of the conductor post in the through-hole. This beforehand cushioning mechanism compensates for potential manufacturing tolerances, maintaining electrical connection reliability while reducing the stringency of manufacturing precision requirements.
3Productivity
If device size is reduced to improve integration, then productivity is improved, but noise increases
Solution Approach 1:
The patent introduces a shield structure as an intermediary element between noise-generating components. This shield acts as a mediator that blocks or redirects electromagnetic noise while allowing the compact device layout to be maintained, thus preserving integration efficiency while reducing noise interference.
4Reliability
If through-holes are formed to penetrate the insulating board for electrical connection, then electrical connectivity is improved, but structural strength decreases
Solution Approach 1:
The patent employs composite material construction for the insulating board, combining materials with different properties. The board incorporates high-strength reinforcement elements or composite layers that compensate for the strength loss caused by through-holes, maintaining structural integrity while enabling the necessary electrical connections through the penetrated holes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances electrical and thermal connectivity, reduces noise, and improves durability by stabilizing heat dissipation and electrical resistance, effectively addressing the challenges of repetitive heat cycles and noise in power system circuits.
Implementation Method 1
the through holes being formed to penetrate the insulating board and being used to electrically connect the conductor circuit of the top surface and the conductor circuit of the bottom surface
Implementation Method 2
The head portion of the conductor post is inserted until the first surface of the flange portion comes into contact with the bottom surface of the wiring board
Data Source
AI summary
A semiconductor device includes wiring boards each having an insulating board, conductor circuits and through-holes, the insulating board having top and bottom surfaces, the conductor circuits formed on the top and bottom surfaces, the through holes penetrating the insulating board and electrically connecting the conductor circuits of the top and bottom surfaces; conductor posts each having flange, head and leg portions, the flange portion having first and second surfaces and having an external diameter larger than that of the through-hole, the head portion protruding from the first surface, the leg portion protruding from the second surface; and electronic components each having an electrode formed on one or more surfaces and connected to the leg portion. The head portion is inserted until the first surface of the flange portion comes into contact with the bottom surface of the wiring board and electrically connected at an inner wall of the through-hole.