Current Conductor Recess Layout for Isolated Magnetic Current Sensing

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Solution Overview

Problem

Existing magnetic field sensors are often large and costly, and there is a need for more compact and cost-effective solutions that can efficiently measure electric current without requiring complex encapsulation of the magnetic field sensor chip.

Innovation Solution

A sensor device design featuring a current conductor with a recess housing a galvanically isolated magnetic field sensor chip, which can be an unpackaged bare die, allowing for simplified construction and improved measurement accuracy by positioning sensor elements at high magnetic field strength without additional encapsulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional encapsulation methods are used for magnetic field sensor chips, then reliability and protection are improved, but device size and manufacturing complexity increase

Engineering Contradiction:

Improvesensor chip protectionVSAvoidsensor device size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The current conductor and sensor chip mounting surface are merged into a single integrated component. The current conductor serves dual functions: conducting current and providing the mounting surface for the sensor chip, eliminating the need for separate encapsulation structures and reducing overall device volume.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The sensor chip is extracted from traditional encapsulation and mounted directly on the current conductor's integrated mounting surface. This removes the bulky encapsulation material while maintaining galvanic isolation through the recess structure and adhesive layer.

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If traditional encapsulation structures are used, then sensor chip protection is improved, but manufacturing cost and complexity increase

Engineering Contradiction:

Improvesensor chip protectionVSAvoidencapsulation structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Multiple functions are merged into the current conductor: current conduction, structural support, and sensor chip mounting. This integration eliminates separate encapsulation components and simplifies the manufacturing process while maintaining sensor chip protection through the recess and adhesive layer.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The current conductor is designed as a multi-functional component that simultaneously conducts electrical current, provides mechanical support, and serves as the mounting surface for the sensor chip. This universality reduces the number of components needed and simplifies manufacturing.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If magnetic field sensor chip is positioned away from current conductor, then galvanic isolation is improved, but measurement precision decreases

Engineering Contradiction:

Improvegalvanic isolationVSAvoidmagnetic field detection accuracy

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

The current conductor features a localized recess structure that creates distinct functional zones: the recess area provides galvanic isolation while the sensor chip positioned within this recess maintains close proximity to the current conductor for high measurement precision. The adhesive layer in the recess provides both isolation and mechanical bonding.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Galvanic isolation is achieved in the vertical dimension through the recess depth and adhesive layer thickness, while maintaining horizontal proximity between the sensor chip and current conductor. This dimensional separation allows simultaneous achievement of isolation and measurement accuracy.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves smaller, cost-effective magnetic field sensors with enhanced measurement capabilities by simplifying production, enabling various geometric configurations and eliminating the need for bonding wires, while ensuring effective galvanic isolation and improved measurement precision.

Implementation Method 1

a magnetic field sensor chip, which is arranged in the recess on a mounting surface of the current conductor and is configured to detect a magnetic field generated by the electric current

Methodology Applied

Scientific EffectMagnetic field detection: Magnetic Field

Data Source

PatentUS20260072058A1Sensor devices and associated production methods

Publication Date: 2026.03.12 INFINEON TECHNOLOGIES AG

AI summary

A sensor device contains a current conductor with a recess, wherein the current conductor is configured to conduct an electric current. The sensor device further contains a magnetic field sensor chip, which is arranged in the recess on a mounting surface of the current conductor and is configured to detect a magnetic field generated by the electric current. The current conductor and the magnetic field sensor chip are galvanically isolated from each other.