Conductor Roll Copper Plating Prevention via Electrolysis
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Solution Overview
Problem
Existing methods for preventing copper plating on conductor rolls are inadequate, as they fail to completely remove residual copper particles and complicate the electroplating process, affecting the quality of the plating product and requiring additional steps.
Innovation Solution
A device and method that involves an electroplating pool with auxiliary tanks and electrodes, where the conductor roll acts as both a cathode for electroplating and an anode for electrolysis, using a second power source to create an electrolysis loop that balances copper electroplating and electrolysis, preventing residual copper deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical methods (spraying or scraping) are used to remove copper from the conductor roll, then copper removal is achieved, but residual copper particles remain and the process becomes complicated
Solution Approach 1:
The patent replaces mechanical copper removal methods (spraying and scraping) with an electrochemical electrolysis system. By applying a reverse current through the conductor roll, copper deposits are dissolved electrochemically, achieving complete removal without residual particles and avoiding the complexity of multiple mechanical steps
Solution Approach 2:
The patent changes the electrical parameters by introducing a second power source that applies a reverse polarity current to the conductor roll. This parameter change transforms the conductor roll from a cathode during plating to an anode during electrolysis, enabling complete copper removal through electrochemical dissolution
2Loss of substance
If physical copper removal methods are used, then deposited copper is removed, but residual copper particles cannot be completely eliminated
Solution Approach 1:
The patent replaces mechanical removal with electrochemical electrolysis, which dissolves copper deposits at the molecular level. This electrochemical process completely eliminates residual copper particles that mechanical methods cannot remove, achieving superior cleaning effectiveness
3Reliability
If additional copper removal steps are added to the electroplating process, then copper can be removed, but the equipment implementation process becomes more complicated
Solution Approach 1:
The patent merges the copper removal function into the existing electroplating equipment by utilizing the conductor roll and bath system already present. The second power source is integrated with the existing plating power source, combining plating and electrolysis functions in a unified system without requiring separate removal equipment
Solution Approach 2:
The conductor roll serves dual functions: as a cathode during electroplating and as an anode during electrolysis. The bath system also serves both plating and electrolysis purposes, eliminating the need for separate equipment and simplifying the overall implementation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively balances copper electroplating and electrolysis on the conductor roll, improving the quality of the plating product without increasing the complexity of the electroplating process and eliminating residual copper, using a simple structure with a small electrolytic cell.
Implementation Method 1
the auxiliary electrode is connected to the negative output end of a second power source, and the other end of the conductor roll is connected to the positive output end of the second power source
Implementation Method 2
the electroplating anode is connected to the positive output end of a first power source, one end of the conductor roll is connected to the negative output end of the first power source
Data Source
AI summary
The present invention discloses a device and method for preventing copper plating of a conductor roll in the technical field of manufacturing of copper electroplating films. A conductor roll and an electroplating anode are respectively connected to the negative output end and the positive output end of a first power source, the conductor roll and the electroplating anode electroplate a plating product flowing through plating pool bath after being electrified, and the conductor roll is connected to the positive output end of a second power source and mated with an auxiliary electrode connected to the negative output end of the second power source to realize the electrolysis of the conductor roll so that the conductor roll avoids copper deposition when electroplating the plating product. The present invention can realize the electrolysis of bath near the conductor roll on the premise of completing electroplating by the conductor roll so that the copper electroplating process and the copper electrolyzing process are balanced on the conductor roll to avoid residual copper on the conductor roll so as to improve the copper plating quality of the plating product, and the present invention does not increase the procedure of the electroplating process or affect the implementation of the electroplating process.