Enlargement-free Conductor Track Transition for High-Frequency PCBs
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Solution Overview
Problem
Conventional printed circuit board technologies face challenges in efficiently handling high-frequency signals with minimal loss and maintaining miniaturization, as they often require pads for transition between conductor tracks and vias, leading to parasitic effects and increased energy consumption.
Innovation Solution
A method for manufacturing electronic devices with a widening-free transition between conductor tracks and contact structures, using a common process to form conductive traces and contact structures directly in an insulative support structure, eliminating the need for pads and allowing for seamless, low-loss propagation of high-frequency signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a pad is used for transition between conductor track and via, then manufacturing tolerances are compensated, but parasitic effects increase and energy consumption rises
Solution Approach 1:
The invention extracts and eliminates the pad structure from the transition between conductor track and via. By directly connecting the via to the conductor track without an intermediate pad, the patent removes the source of parasitic effects and associated energy losses while maintaining manufacturing feasibility through precise alignment processes
Solution Approach 2:
The invention merges the conductor track and via into a seamless continuous conductive path. The via is directly integrated with the conductor track, eliminating the boundary and pad structure that previously separated these elements, thereby reducing parasitic capacitance and inductance
2Manufacturing precision
If a pad is used for transition between conductor track and via, then manufacturing tolerances are compensated, but parasitic effects increase
Solution Approach 1:
The pad structure that generates parasitic effects is extracted and removed from the design. The direct via-to-conductor-track connection eliminates the parasitic capacitance and inductance associated with pad structures while relying on precision manufacturing to maintain alignment
Solution Approach 2:
Instead of using a pad to bridge the conductor track and via, the invention inverts the approach by making the via itself the connecting element that directly interfaces with the conductor track, eliminating the need for an intermediate pad structure
3Loss of energy
If connection paths are shortened for miniaturization, then energy consumption reduces, but manufacturing precision requirements increase
Solution Approach 1:
The invention transitions from two-dimensional pad-based connections to three-dimensional direct via-to-track integration. By utilizing vertical via structures that directly penetrate the substrate and connect to conductor tracks, the patent achieves shorter connection paths while maintaining manufacturing feasibility through precise spatial positioning
4Loss of energy
If pads are eliminated for seamless transition, then energy loss reduces, but manufacturing complexity increases
Solution Approach 1:
The via structure is given multiple functions: it serves as both the connection element and the alignment reference for the conductor track. This multi-functionality eliminates the need for separate pad structures while integrating alignment and connection functions into a single manufacturable feature
Data Source
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AI summary
The invention relates to an electronic device (100) having an electrically insulating support structure (102), an electrically conductive conductor path (104) on a surface of the support structure (102), and an electrically conductive contact structure (106) which extends from the surface into the support structure (102) and is electrically connected to the conductor path (104) at a connection point (108), thereby forming a common conductor track (110). The conductor path (104) and the contact structure (106) transition into each other in an enlargement-free manner at the connection point (108).