Connection Conductor Wave Forming Without Gear-Induced Damage
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Solution Overview
Problem
Existing methods for forming connecting conductors for semiconductor components, such as those used in solar cell modules, often result in thermomechanical stresses and damage due to the use of interlocking gears, leading to non-uniform resistance and increased line resistance, as well as deformation issues that can cause degradation or failure of the components.
Innovation Solution
A processing device with a molding unit and a feed unit that allows for the bending of connecting conductors between a stop element and a mold element, where the mold element is displaced relative to the stop element, reducing damage and enabling variation in the amplitude and period length of the periodic structure, allowing for flexible production of connecting conductors with changing amplitudes and period lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If interlocking gears are used to form periodic structure in connecting conductors, then the connecting conductor obtains a predetermined wave-like structure, but the connecting conductor suffers damage and develops non-uniform cross-section with increased line resistance
Solution Approach 1:
The patent replaces the gear-based mechanical system with a roller-based bending system. Instead of using interlocking gears that cause damage through their toothed engagement, the invention uses smooth rollers that bend the connecting conductor through controlled mechanical pressure, eliminating the damaging gear teeth contact while still achieving the desired periodic wave-like structure
Solution Approach 2:
The patent changes the geometric parameters of the forming tool from gear teeth profiles to roller profiles with specific radii. The roller radius and the distance between rollers are optimized to produce the desired wave amplitude and period length without causing conductor damage or cross-section deformation
2Shape
If interlocking gears are used to bend connecting conductors, then periodic structure is formed, but the cross section becomes tapered at periodic intervals resulting in non-uniform line resistance
Solution Approach 1:
The patent substitutes the gear-based bending mechanism with a roller-based bending mechanism. The smooth surface of the rollers prevents the localized stress concentration and material displacement that occurs with gear teeth, thereby maintaining uniform cross-section throughout the periodic structure formation process
Solution Approach 2:
The patent optimizes the roller radius and spacing parameters to achieve the desired wave-like shape while maintaining cross-sectional uniformity. By carefully selecting these geometric parameters, the bending process distributes stress evenly along the conductor, preventing tapering effects
3Ease of manufacture
If fixed geometry gears are used, then the period length and amplitude are determined by gear geometry, but the device lacks flexibility for different applications
Solution Approach 1:
The patent transforms the static gear geometry into dynamic roller positioning. Instead of fixed gear tooth profiles that determine the wave shape, the system uses adjustable roller positions and radii that can be modified during operation or between production runs, enabling flexible control of amplitude and period length for different application requirements
Solution Approach 2:
The patent creates a universal forming system where the same roller-based mechanism can produce various wave-like structures with different amplitudes and period lengths by simply adjusting roller positions and sizes. This multi-functional approach eliminates the need for different gear sets for different applications
4Strength
If connecting conductors are used with semiconductor components, then electrical and mechanical interconnection is achieved, but thermomechanical stresses and deformation occur due to different expansion coefficients
Solution Approach 1:
The patent creates a periodic wave-like structure in the connecting conductor that distributes thermomechanical stresses evenly along its length. The wave pattern allows the conductor to expand and contract in a controlled manner, reducing stress concentration at any single point and minimizing deformation of the connected semiconductor components
Solution Approach 2:
The patent modifies the connecting conductor from a straight configuration to a periodic wave-like configuration. This geometric transformation changes the mechanical properties of the conductor, allowing it to better accommodate thermal expansion differences between the conductor and semiconductor components while maintaining electrical and mechanical connectivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes damage and tapering of the connecting conductors, reducing failures and degradations, and allows for the production of connecting conductors suitable for various semiconductor components with different geometric requirements, while also reducing friction and improving the precision of the bending process.
Implementation Method 1
the connecting conductor can be bent between the stop element and form element by moving the form element by means of the form element displacement unit
Data Source
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AI summary
The invention relates to a processing device for forming connection conductors for semiconductor components, in particular for producing a periodic structure, which device comprises a forming unit for forming at least one connection conductor. The invention is characterized in that the processing device comprises an advancing unit which is designed to move the connection conductors and the forming unit relative to one another in a direction of advance, and in that the forming unit has at least one step element, at least one forming element which can be moved relative to the step element, and a forming-element moving unit for moving the forming element relative to the stop element, the forming element, stop element and forming-element moving unit being designed to cooperate such that the connection conductor can be bent by moving the forming element between the stop element and the forming element by means of the forming-element moving unit. The invention further relates to a method for forming connection conductors for semiconductor components.