Conduitless Immersion Cooling with Cross-Flow Inducer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic cooling systems are inefficient and energy wasteful, particularly for heat-producing components, as they often require cumbersome cooling methods and the use of thermal interface materials, and lack effective internal circulation systems using liquid dielectric coolants.
Innovation Solution
A novel immersion cooling tank design featuring a conduitless flow path with internal circulation using a cross-flow circulation inducer and secondary heat exchanger, where warmed dielectric liquid flows through a secondary heat exchanger and is cooled before recirculating to cool heat-producing components, eliminating the need for thermal interface materials and enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional pipe systems with thermal interface materials are used to transfer coolant, then heat transfer from components to coolant is achieved, but system complexity and energy consumption increase
Solution Approach 1:
The patent removes thermal interface materials (TIM) and traditional pipe systems from the cooling architecture. Electronic components are directly immersed in dielectric coolant, eliminating the need for intermediate heat transfer materials and complex piping infrastructure. This extraction of unnecessary components directly reduces both system complexity and energy consumption associated with pump-driven flow through restrictive pathways.
Solution Approach 2:
The cooling system merges the coolant reservoir, heat exchange functionality, and component mounting environment into a single integrated immersion tank. The dielectric coolant serves multiple functions simultaneously: it acts as the cooling medium, the electrical insulator, and the direct thermal contact medium. This consolidation eliminates separate cooling loops and reduces overall system complexity.
2Productivity
If out-of-tank circulation loops are used for coolant cooling, then warmed coolant is cooled and returned to the tank, but the system becomes cumbersome and less efficient
Solution Approach 1:
The heat exchanger is nested directly within the immersion tank, allowing warmed dielectric coolant to be cooled in-place without leaving the tank environment. This nested configuration enables the coolant to flow through heat exchange surfaces that are submerged in a secondary cooling medium, maintaining the immersion architecture while providing effective coolant temperature control.
Solution Approach 2:
The system utilizes natural convection currents driven by temperature-induced density differences in the dielectric coolant. Warmer, less dense coolant rises naturally while cooler, denser coolant sinks, creating self-sustaining circulation patterns that reduce or eliminate the need for high-power pump systems, thereby improving cooling efficiency while reducing system complexity.
3Reliability
If thermal interface materials are used between components and coolant, then heat transfer is facilitated, but the system requires additional materials and maintenance
Solution Approach 1:
The patent completely removes thermal interface materials from the system architecture. Electronic components are directly immersed in dielectric coolant, allowing the coolant to serve as both the thermal transfer medium and the electrical insulator. This eliminates the need for separate TIM applications, reducing system complexity and maintenance requirements while maintaining reliable heat transfer through direct liquid-to-component contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies immersion cooling by utilizing dielectric fluid circulation within the tank, achieving efficient heat management and mobility, while maintaining optimal component temperatures without energy wastage, suitable for various applications from gaming to supercomputing.
Implementation Method 1
Flow is caused in part by the heat differentials in the sub-chambers and in part by the cross-flow wave inducer function. Cooled dielectric liquid sinks to the tank bottom after leaving the secondary heat exchanger. It then flows into the first sub-chamber by virtue of the function of the cross-flow wave inducer[s]. The flow continues upward in the first sub-chamber cooling the at least one component as it flows.
Implementation Method 2
In some embodiments, additional circulation impetus comes from the natural rising of warmed liquid and sinking of cooled liquid.
Implementation Method 3
In the second sub-chamber is a secondary heat exchanger which is set up so that all warmed dielectric liquid leaving the electronic component[s] must flow through the secondary heat exchanger.
Data Source
AI summary
A two chamber immersion cooling tank for cooling at least one heat producing electronic component is described. In one sub-chamber, the at least one electronic component is appropriately secured in the tank which is filled with dielectric fluid that maintains liquid form throughout the cooling procedure. In the circulation path, prior to the component[s], is at least one cross-flow wave inducer. In the second sub-chamber is a secondary heat exchanger which is set up so that all warmed dielectric liquid leaving the electronic component[s] must flow through the secondary heat exchanger in the second sub-chamber.Flow may be vertical or horizontal with respect to the effects of gravity. If a hermetically sealed top is present, orientation can be variable and the system may be used in mobile field or vehicle applications.