Configurable Bay Mounting for EDSFF Disk Density

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Solution Overview

Problem

Current information handling systems, particularly server type systems, face challenges in efficiently mounting and arranging disks of different form factors like EDSFF E1 and E3, as they cannot coexist at the same density using standard disk bay mechanicals.

Innovation Solution

A configurable bay device mounting system with backplane-decoupled disk bay mechanical inserts that allow optimal arrangement of EDSFF disk form factors, enabling any backplane type to be installed and allowing for swappable chassis front ends, including exchange of entire disk bay spaces and backplane mechanicals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If standard disk bay mechanicals are used, then mounting simplicity is maintained, but different form factor disks (EDSFF E1 and E3) cannot coexist at the same density

Engineering Contradiction:
Improvecompatibility with different disk form factorsVSAvoidbay mechanical configuration
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements configurable bay mechanicals that can dynamically change their mounting configuration. The side walls are designed to be repositionable between different positions, allowing the same physical bay structure to adapt its geometry to accommodate different disk form factors (E1, E3, etc.) while maintaining optimal density for each type.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The bay mechanical structure is designed as a universal mounting system that can handle multiple disk form factors through a single integrated mechanism. By incorporating reconfigurable side walls and adjustable mounting features, the same bay structure serves multiple functions - accommodating different disk types without requiring separate dedicated mechanicals for each form factor.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Productivity

If fixed bay configurations are used, then manufacturing simplicity is maintained, but space utilization efficiency decreases

Engineering Contradiction:
Improvespace utilization efficiencyVSAvoidbay mechanical design
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The bay mechanicals incorporate movable and reconfigurable components that allow the system to optimize space utilization based on the specific disk configuration required. The side walls can be positioned at different locations to create optimal mounting geometries for various disk form factors, thereby maximizing space efficiency rather than relying on fixed, suboptimal configurations.

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If standardized mounting systems are used, then ease of manufacture is maintained, but flexibility in arranging different disk form factors is limited

Engineering Contradiction:
Improvedisk arrangement flexibilityVSAvoidbay mechanical production
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The bay mechanical structure is divided into modular segments, particularly the side walls that can be independently positioned and configured. This segmentation allows the system to achieve high adaptability for different disk arrangements while maintaining manufacturing simplicity through modular assembly of standardized components rather than requiring completely custom-built mechanicals for each configuration.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20240365497A1Server System Configurable Bay Device Mounting System
Publication Date: 2024.10.31 DELL PROD LP
  • US20240365497A1 patent drawing
  • US20240365497A1 patent drawing
  • US20240365497A1 patent drawing

AI summary

A configurable bay device mounting system. The configurable bay device mounting system includes a device bay, the device bay being defined by a first side wall, a second side wall, a top plate and a bottom plate, the device bay being configurable to mount a plurality of devices conforming to one or both of a first form factor and a second form factor. In certain embodiments, the first form factor corresponds to an enterprise and datacenter standard form factor (EDSFF) E3 form factor and the second form factor corresponds to an EDSFF E1 form factor.