Package-Level Semiconductor Assembly for Configurable ESD Capacitance
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Solution Overview
Problem
Semiconductor devices with ESD protection circuits connected to the same bond pad as active circuits face challenges in optimizing capacitance when packaged in different densities, leading to excess capacitance and performance degradation.
Innovation Solution
Semiconductor devices are designed with separate contact pads for active and passive circuits, allowing for customizable ESD protection by connecting only the necessary ESD protection circuits to the substrate, thereby optimizing capacitance for various packaging densities using multiple identical dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ESD protection circuits are connected to the same bond pad as active circuits, then ESD protection is provided, but excess capacitance degrades device performance
Solution Approach 1:
The bond pad is segmented into multiple separate bond pads, allowing the active circuit and ESD protection circuit to be electrically separated. Each circuit type has its own dedicated bond pad, preventing capacitance coupling while maintaining individual functionality. This segmentation resolves the contradiction by enabling ESD protection without the harmful capacitive coupling that degrades performance.
Solution Approach 2:
The ESD protection circuit is extracted from the shared bond pad connection and placed on a separate bond pad. This extraction removes the source of excess capacitance from the active circuit's signal path while preserving the ESD protection function. The harmful capacitive coupling is eliminated by taking out the ESD circuit from the shared electrical connection.
2Reliability
If different semiconductor dies are designed for different package densities, then optimal ESD protection can be achieved for each configuration, but manufacturing cost increases prohibitively
Solution Approach 1:
A single universal die design with multiple separate bond pads can be configured for different package densities by selectively connecting or disconnecting ESD protection circuits during assembly. The same die type serves multiple packaging configurations, eliminating the need for different die designs. This universality maintains optimal ESD protection while significantly reducing manufacturing costs through standardized die production.
Solution Approach 2:
The ESD protection circuit connectivity is made dynamic and reconfigurable through selective bonding techniques. During the packaging process, ESD protection circuits can be selectively connected or disconnected based on the desired package density, allowing a single die design to adapt to different configurations. This dynamic reconfigurability eliminates the need for multiple fixed die designs.
3Productivity
If multiple identical dies are used with customizable ESD protection, then manufacturing efficiency improves, but complex packaging processes are required to achieve configurability
Solution Approach 1:
The bond pad structure is segmented into functionally distinct pads, with ESD protection circuits having separate accessible bond pads. This segmentation enables selective connection of ESD circuits during packaging without requiring complex internal die modifications. The simplified die structure with clear functional separation reduces packaging process complexity while maintaining manufacturing efficiency.
Data Source
AI summary
A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.