Configurable Flip Chip Substrate Bond Pads
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Solution Overview
Problem
Flip chip integrated circuit packages lack functional flexibility, requiring new substrates for functional changes due to the fixed connectivity of solder bumps, leading to high costs and complex manufacturing processes.
Innovation Solution
Incorporating selectively electrically conductive features on the substrate that can be coupled or decoupled using an electrically conductive material, allowing for the reconfiguration of signal nets without altering the substrate, similar to wire bond packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder bumps are used to connect die to substrate in flip chip packages, then connection density and electrical performance are improved, but functional flexibility is lost because solder bumps can only connect to pads directly opposite them
Solution Approach 1:
The substrate is segmented into multiple conductive layers with conductive features that can be independently configured. This segmentation allows different signal paths to be created by selectively connecting conductive features across layers, enabling functional flexibility while maintaining the reliability of solder bump connections.
Solution Approach 2:
The patent introduces vertical dimensionality by stacking multiple conductive layers within the substrate. This allows signal nets to be routed through different layers and connected via conductive features, enabling reconfiguration of signal paths without changing the physical position of solder bumps, thus achieving functional flexibility while maintaining connection reliability.
2Adaptability or versatility
If wire bonds are used to provide functional flexibility in BGA packages, then adaptability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the advantages of wire bond flexibility with flip chip density by integrating configurable conductive features directly into the substrate structure. This eliminates the need for separate wire bond components while maintaining functional flexibility, thereby reducing device complexity and manufacturing cost.
Solution Approach 2:
The substrate is designed with universal conductive features that can be configured to create different signal paths for different applications. This multi-functionality allows a single substrate design to support various functional configurations without requiring additional components like wire bonds, reducing overall package complexity.
3Adaptability or versatility
If multiple layers are added to flip chip substrate to enable routing flexibility, then adaptability is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The substrate is manufactured with pre-configured conductive layers and features during the standard PCB fabrication process. This preliminary action allows routing flexibility to be built into the substrate structure itself, eliminating the need for complex post-fabrication modifications or additional manufacturing steps, thereby controlling manufacturing cost.
Data Source
AI summary
Methods, systems, and apparatuses for integrated circuit package substrates, integrated circuit packages, and processes for assembling the same, are provided. A substrate for a flip chip integrated circuit package includes a substrate body having opposing first and second surfaces. A solder mask layer covers at least a portion of the first surface of the substrate body. First and second electrically conductive features are formed on the substrate body. The first electrically conductive feature is a portion of a first electrical signal net, and the second electrically conductive feature is a portion of a second electrical signal net. The first and second electrically conductive features are configured to be selectively electrically coupled together by application of an electrically conductive material. The electrically conductive material may be a conductive epoxy, a jumper, a solder paste, a solder ball, or a solder bump that couples a flip chip die to the substrate.