Configurable IO Interface Circuit for Single-Ended and Differential Communication
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Solution Overview
Problem
Current semiconductor package technologies face challenges in intra-package and inter-package communication due to limitations in single-ended signaling, including crosstalk, poor termination, and reference noise, which affect signal integrity and efficiency.
Innovation Solution
A multi-package system utilizing configurable input/output (IO) interface circuits that can be configured for either single-ended intra-package communication or differential inter-package communication, employing a shared circuit design for both intra-die and inter-die interfaces to optimize communication efficiency and reduce redundancy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate silicon intellectual property blocks are used for single-ended and differential interfaces, then communication functionality is ensured, but device complexity and redundancy increase
Solution Approach 1:
The configurable IO interface circuit is designed to perform multiple functions by switching between single-ended and differential communication modes. The same physical circuit infrastructure supports both communication types, eliminating the need for separate silicon IP blocks and reducing device complexity while maintaining full communication functionality.
Solution Approach 2:
The IO interface circuit incorporates dynamic configuration capability, allowing it to adapt its operating mode (single-ended or differential) based on communication requirements. This dynamic switching is achieved through configurable circuit elements that can reconfigure the signal path and termination characteristics on-demand.
2Device complexity
If single-ended signaling is used for inter-package communication, then device complexity is reduced, but signal integrity deteriorates due to crosstalk, poor termination, and reference noise
Solution Approach 1:
The circuit configuration changes key electrical parameters dynamically. For inter-package communication, the circuit switches to differential mode with corresponding parameter changes including impedance matching, termination resistance values, and signal voltage levels optimized for differential signaling, thereby improving signal integrity over long inter-package traces.
3Adaptability or versatility
If configurable IO interface circuits are used for both single-ended and differential communication, then adaptability improves, but circuit design complexity increases
Solution Approach 1:
The patent merges the single-ended and differential interface circuits into a unified configurable IO interface. By combining previously separate circuit designs into a single integrated structure with shared components and a common signal path, the overall circuit design complexity is reduced while maintaining the ability to operate in both modes.
Data Source
AI summary
A multi-package system includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first die and a second die. The second semiconductor package includes a third die. A first processing circuit of the first die communicates with a second processing circuit of the second die through a first configurable input/output (IO) interface circuit of the first die and a third configurable IO interface circuit of the second die that are configured to perform single-ended intra-package communication. The first processing circuit of the first die communicates with a third processing circuit of the third die through a second configurable IO interface circuit of the first die and a fourth configurable IO interface circuit of the third die that are configured to perform differential inter-package communication. The first configurable IO interface circuit and the second configurable IO interface circuit have a same circuit design.