Configurable Multi-Mode Serial Link Interfaces for MCMs
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Solution Overview
Problem
High-speed multi-chip communication within a single integrated circuit package faces challenges in achieving efficient and cost-effective data transfer due to increased defect density and complexity with larger chip sizes, necessitating innovative signaling methods to reduce power consumption and circuit complexity.
Innovation Solution
The implementation of a multi-chip module architecture with a master integrated circuit generating a timing signal for source synchronous data transfer between IC chips, utilizing bidirectional signaling links with optimized termination impedance and hybrid cancellation techniques to minimize power dissipation and eliminate the need for complex clock generation and equalization circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple chips are integrated into a single package for high-throughput communication, then data transfer capability is improved, but power consumption and circuit complexity increase
Solution Approach 1:
The serial link interface is designed to support multiple communication modes (single-duplex and dual-duplex) and multiple data rates (1.25 Gbps, 2.5 Gbps, 5 Gbps) through a single unified circuit architecture. The transceiver circuit can be configured to operate in different modes by enabling or disabling specific functional blocks, eliminating the need for separate dedicated circuits for each mode and reducing overall device complexity.
Solution Approach 2:
The serial link interface employs dynamic configuration capabilities where the communication mode (single-duplex or dual-duplex) and data rate (1.25/2.5/5 Gbps) can be selected and changed based on operational requirements. This dynamic adaptability allows the same hardware to optimize performance for different scenarios without requiring multiple fixed-configuration circuits.
2Productivity
If multiple chips are integrated into a single package for high-throughput communication, then data transfer capability is improved, but power consumption increases
Solution Approach 1:
The patent combines transmit and receive functional blocks into a single integrated transceiver circuit on each chip. By merging these functions and sharing common resources such as timing signal generation, serialization/deserialization logic, and hybrid cancellation circuits, the overall power consumption is reduced compared to having separate dedicated circuits for each function.
Solution Approach 2:
The interface supports variable data rates (1.25, 2.5, and 5 Gbps) that can be selected based on communication distance and signal integrity requirements. By allowing dynamic parameter changes in operating speed, the system can consume less power for shorter distances or less demanding applications while maintaining high throughput capability when needed.
3Measurement precision
If complex timing circuits are used for synchronous data transfer, then timing precision is improved, but device complexity increases
Solution Approach 1:
A dedicated timing signal is introduced as an intermediary carrier to synchronize data transfer between chips. The timing signal is generated by a master chip and distributed to slave chips, providing a common reference clock that coordinates serialization and deserialization operations. This intermediary timing mechanism achieves precise synchronization without requiring complex bidirectional clock negotiation or phase-locked loops on each chip.
Solution Approach 2:
The master chip automatically generates and distributes the timing signal to all slave chips in the system. Each slave chip receives the timing signal and uses it locally to synchronize its operations, eliminating the need for complex timing negotiation protocols or multiple clock domains that would increase circuit complexity.
4Adaptability or versatility
If larger chip sizes are used to integrate more functions, then functionality is improved, but manufacturing yield decreases
Solution Approach 1:
The system is divided into multiple separate chips, each containing a transceiver circuit with core communication functions (serialization, deserialization, hybrid cancellation). By segmenting the overall system into modular chip units rather than integrating all functions into a single large chip, manufacturing yield is improved while still achieving high functionality through multi-chip integration in a package.
Solution Approach 2:
Multiple functional chips are nested together within a single integrated circuit package to form a complete multi-chip module. Each chip contains essential communication functions, and by nesting them in a package with controlled impedance traces and proper spacing, the system achieves high functionality equivalent to a large chip while maintaining the manufacturing advantages of smaller individual chips.
Data Source
AI summary
A configurable serial link interface circuit is disclosed. The configurable serial link interface includes a first transceiver for coupling to a first serial link. The first transceiver includes a first transmit circuit to selectively drive first transmit data along the first serial link and a first receive circuit. the first receive circuit selectively receives first receive data along the first serial link. The interface includes a second transceiver for coupling to a second serial link. The second transceiver includes a second transmit circuit to selectively drive second transmit data along the second serial link, a second receive circuit to selectively receive second receive data along the second serial link, and control circuitry to control the selectivity of the first transmit circuit, the second transmit circuit, the first receive circuit and the second receive circuit. For a first mode of operation, the control circuitry configures the first and second transceivers to define a dual-duplex architecture. For a second mode of operation, the control circuitry configures the first and second transceivers to define a single-duplex architecture.