Configurable Probe Fixture for Modular PCB In-Circuit Testing
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Solution Overview
Problem
Traditional bed-of-nails testers for printed circuit board assemblies incur high costs and lack flexibility due to the need for multiple customized probe plates for different tests, leading to duplication of components, increased labor, and time-consuming modifications.
Innovation Solution
A modular testing apparatus with a configurable probe structure, featuring a mounting plate, base plate, docking plate, and interchangeable probe modules, allowing for quick reconfiguration of probe sets to accommodate various test procedures without the need for multiple customized probe plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple customized probe plates are used for different test types, then testing coverage and reliability are improved, but device complexity and manufacturing costs increase
Solution Approach 1:
The probe plate is divided into multiple modular probe modules that can be independently configured and removed. Each module contains a specific set of probes arranged in particular patterns, allowing the system to be segmented into functional units that can be selectively assembled based on test requirements.
Solution Approach 2:
A single universal probe plate structure is designed with multiple mounting locations and configurations, allowing it to perform multiple test functions. The plate can accommodate different probe modules for continuity testing, functional testing, and other test types, making one plate serve multiple purposes that previously required separate customized plates.
2Adaptability or versatility
If multiple customized probe plates are created for different test procedures, then testing versatility is improved, but manufacturing costs and labor increase
Solution Approach 1:
By segmenting the probe plate into standardized modules with uniform mounting interfaces, the manufacturing process is simplified. Each module can be manufactured using the same base design and assembly procedures, reducing the need for custom manufacturing for each test type while maintaining versatility through modular configuration.
Solution Approach 2:
Instead of manufacturing entirely new probe plates for each test type, the system allows for the removal and replacement of individual probe modules. The base plate and previously manufactured modules are recovered and reused, discarding only the specific module configuration that is no longer needed, thereby reducing manufacturing costs and labor.
3Adaptability or versatility
If probe plates are modified or replaced for changed test requirements, then testing flexibility is improved, but time consumption and costs increase
Solution Approach 1:
The probe plate system is designed with dynamic reconfigurability, allowing probe modules to be quickly removed and replaced without permanent modifications. The standardized mounting mechanisms enable rapid reconfiguration to adapt to changing test requirements, eliminating the time-consuming process of modifying fixed probe plates.
Solution Approach 2:
The modular segmentation allows individual probe modules to be independently removed and replaced. When test requirements change, only the specific module needing adjustment is removed and replaced, rather than requiring modification or replacement of the entire probe plate, significantly reducing reconfiguration time.
4Reliability
If all solder pads on the bottom surface are used for testing, then testing completeness is improved, but testing costs and complexity increase
Solution Approach 1:
Different regions of the probe plate are designed with different probe densities and configurations based on the specific test requirements. Not all areas of the bottom surface require equal testing coverage, so the probe modules can be selectively positioned to provide appropriate local quality of testing where needed, reducing overall complexity while maintaining necessary completeness.
Solution Approach 2:
The system allows for partial testing configurations where only the necessary subset of solder pads is tested based on the specific test procedure. Instead of requiring all possible test points to be accessed simultaneously, the modular probe modules enable selective activation of only the needed test points, reducing complexity while maintaining testing effectiveness for the intended purpose.
Data Source
AI summary
Illustrative embodiments disclosed herein pertain to a testing apparatus for performing in-circuit tests upon a printed circuit board assembly. Each of these tests may require the use of a set of probes arranged in a customized layout. This is traditionally accomplished by using a set of predefined probe plates, some or all of which may include probes that are either redundant or duplicated amongst the various probe plates, thereby introducing an undesirable cost penalty. A testing apparatus in accordance with the disclosure incorporates a configurable probe fixture that includes a docking plate configured to support a first set of probe modules for carrying out a first test upon a printed circuit board assembly. Some or all of the probe modules can then be selectively removed or replaced by other probe modules for reconfiguring the testing apparatus to carry out other tests upon the printed circuit board assembly.