Configurable Probe With Integrated Impedance For Electrical Testing

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Solution Overview

Problem

The challenge in electrical testing is the difficulty in accurately measuring AC timing and voltage parameters due to the requirement for a specified compliance load and measurement point proximity to the device under test, which complicates soldering of small, closely spaced components and increases the risk of damaging existing solder joints.

Innovation Solution

A probe configuration that eliminates the need for discrete resistors and capacitors by using conductors with integrated impedance values, allowing for easier placement and reduced solder connections, thereby simplifying the measurement process while maintaining compliance with specifications like the PCI Express Base Specification.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If discrete resistors and capacitors are used to create compliance load, then measurement accuracy is improved, but device complexity and soldering difficulty increase

Engineering Contradiction:
Improvemeasurement accuracyVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines discrete resistors and capacitors into integrated impedance elements that are built into the probe. This merging eliminates the need for separate compliance load components, reducing overall device complexity while maintaining the required measurement accuracy through the integrated impedance network.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The probe is designed with universal impedance elements that can be configured to meet different electrical standards (e.g., PCI Express, USB) without requiring separate discrete components. This multi-functionality allows a single probe design to serve multiple measurement requirements, reducing complexity across different testing scenarios.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If measurement point is placed within 0.2 inches of package pins, then measurement accuracy is improved, but ease of operation deteriorates due to tight space constraints

Engineering Contradiction:
Improvemeasurement accuracyVSAvoidease of operation
Core Design Contradiction:
Measurement precisionVSEase of operation

Solution Approach 1:

The probe tip is segmented into multiple contact points that can be independently positioned and contacted. This segmentation allows the probe to access measurement points within 0.2 inches of package pins by making contact at specific locations on the PCB, reducing the physical space required while maintaining measurement accuracy.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The probe acts as an intermediary between the measurement equipment and the device under test. By incorporating compliance load elements directly into the probe structure, it mediates the connection between the test equipment and the circuit, allowing accurate measurements close to the device without requiring manual adjustment of separate components.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Measurement precision

If multiple discrete components are soldered for compliance load, then measurement accuracy is improved, but manufacturing precision and time consumption increase

Engineering Contradiction:
Improvemeasurement accuracyVSAvoidtime consumption
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The impedance elements are pre-integrated into the probe during manufacturing, performing the compliance load configuration action before the probe reaches the user. This preliminary action eliminates the need for time-consuming soldering of discrete components during testing, while maintaining measurement accuracy through the pre-configured impedance network.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

By merging multiple discrete components into integrated impedance elements within the probe, the patent reduces the number of soldering operations required. The compliance load is built-in, eliminating the need for separate component assembly and reducing both manufacturing time and field installation time.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS7777509B2Method and apparatus for electrical testing
Publication Date: 2010.08.17 NXP USA INC
  • US7777509B2 patent drawing
  • US7777509B2 patent drawing
  • US7777509B2 patent drawing

AI summary

A test apparatus and device under test has a probe that can be located very close to contact pads and that requires very few solder connections. In addition, the probe can be configured to meet any appropriate and desired electrical specification while still using a same circuit board. There is no need to attach discrete components to a circuit board. Thus, by using a configurable probe, a single circuit board may be used with multiple probes or a reconfigurable probe to test for compliance with a variety of different electrical specifications having different requirements.