Configurable Semiconductor Functional Blocks for SKU Reduction
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Solution Overview
Problem
The manufacturing of semiconductor products in application-specific formats leads to complex logistics, high manufacturing costs, and inefficiencies due to the need for separate stock-keeping units and administrative overhead, as well as limitations in upgrading or downgrading features, which restrict customer flexibility and increase waste.
Innovation Solution
A customizable semiconductor product with dynamically enabled or disabled functional modules, allowing configuration changes after delivery through a customizing unit that activates or deactivates specific blocks based on a customizing data structure, enabling flexible configurations and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor products are manufactured in application-specific formats, then security against misuse is improved, but device complexity and logistics complexity increase
Solution Approach 1:
The patent implements a universal semiconductor product platform that can be configured for multiple applications through a customizing unit. The product includes a processor, memory, and customizing unit that work together to enable the same physical device to serve different security-sensitive applications. This universal approach reduces logistics complexity while maintaining security through controlled configuration rather than physical differentiation.
Solution Approach 2:
The patent employs dynamic configuration capabilities where the semiconductor product can change its operational state through the customizing unit. The product transitions from a generic unconfigured state to application-specific configured states based on received configuration data. This dynamic adaptability allows a single product design to replace multiple static application-specific designs, simplifying logistics while preserving security through controlled state changes.
2Reliability
If semiconductor products are manufactured in application-specific formats, then security against misuse is improved, but manufacturing costs and technical effort increase
Solution Approach 1:
The patent creates a universal semiconductor product that can be manufactured once and then configured for multiple applications through software/firmware customization. This eliminates the need to manufacture separate hardware variants for different applications, significantly reducing manufacturing costs and technical effort while maintaining security through the customizing unit's controlled configuration process.
Solution Approach 2:
The patent uses configuration data and firmware images as virtual copies that define application-specific behavior. Instead of creating physical copies of different hardware designs, the system uses software-based configuration templates that can be replicated and applied to the universal hardware platform, reducing manufacturing complexity and cost while maintaining security through controlled configuration distribution.
3Reliability
If semiconductor products are manufactured in application-specific formats, then security against misuse is improved, but stock keeping efficiency decreases
Solution Approach 1:
The patent implements a universal semiconductor product that can serve multiple applications, allowing stock keeping to be simplified to a single product SKU rather than multiple application-specific SKUs. The universal product can be stocked once and then configured for different applications as needed, dramatically improving stock keeping efficiency while maintaining security through the customizing unit's controlled configuration process.
4Reliability
If semiconductor products are manufactured in application-specific formats, then security against misuse is improved, but customer flexibility and upgrade capability decrease
Solution Approach 1:
The patent enables dynamic reconfiguration of the semiconductor product through the customizing unit, allowing customers to upgrade or change applications by receiving new configuration data rather than replacing physical hardware. This dynamic capability provides customer flexibility and upgrade paths while maintaining security through the controlled configuration process, eliminating the limitations of fixed application-specific designs.
Data Source
AI summary
A semiconductor product being convertible or converted from a customizable configuration into a selectable or selected one of a plurality of different customized configurations, wherein the semiconductor product comprises a customizing unit configured for customizing the semiconductor product into one of the customized configurations selected by a received customizing data structure specifying a selected application of the semiconductor product, and a plurality of functional blocks each configured for providing an assigned functionality and all being deactivated when the semiconductor product is not in one of the customized configurations, wherein the customizing unit is configured for activating only a subgroup of the functional blocks based on the received customizing data structure.