Configurable TDP Microprocessor Power Management
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Solution Overview
Problem
Existing power management techniques for microprocessors do not allow for flexible configuration of thermal design power (TDP) specifications, limiting thermal design and performance options for computing systems.
Innovation Solution
A configurable TDP system that allows OEMs to dynamically adjust the TDP of processors by changing base frequencies, enabling multiple TDP levels ('TDP Up', 'Nominal TDP', and 'TDP Down') and modifying turbo capability, using model-specific registers (MSRs) to support runtime power management and turbo boost performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If fixed TDP specifications are used for processors, then manufacturing and platform design are simplified, but thermal design flexibility and performance optimization are limited
Solution Approach 1:
The patent implements dynamic TDP configuration by allowing the processor to operate at multiple discrete TDP levels (e.g., 15W, 35W, 65W) that can be selected and changed during system operation. This is achieved through runtime power management mechanisms that adjust power delivery and thermal design parameters dynamically, enabling the same hardware to adapt to different thermal and performance requirements without requiring multiple fixed-configuration processor designs.
Solution Approach 2:
The patent changes the TDP parameter from a fixed specification to a configurable parameter. By introducing mechanisms to adjust TDP levels and modify power delivery characteristics at runtime, the system allows thermal design parameters to be optimized for specific workloads while maintaining the same physical processor hardware, thus improving adaptability without proportionally increasing device complexity.
2Adaptability or versatility
If multiple discrete processor products with different TDPs are manufactured, then thermal design options are provided, but the number of product families increases
Solution Approach 1:
The patent enables a single processor product to serve multiple thermal design niches by implementing configurable TDP capabilities. Instead of manufacturing separate processor products for different TDP requirements (e.g., mobile, desktop, server variants), the same processor can be configured to operate at different TDP levels through runtime power management, making it universally applicable across various platform types while reducing the overall number of product families that need to be manufactured and supported.
3Use of energy by moving object
If TDP is reduced for mobile processors, then power consumption is lowered, but turbo boost capability and performance are limited
Solution Approach 1:
The patent enables periodic or dynamic adjustment of TDP levels and turbo boost capability based on workload requirements and thermal conditions. The system can alternate between lower TDP modes for power-saving operations and higher TDP modes with turbo boost enabled for performance-intensive tasks, allowing the processor to optimize its power consumption-performance tradeoff dynamically rather than being locked into a single fixed configuration.
Data Source
AI summary
A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.