3D Co-Packaged Confinement Chip and ASIC for Electrode Control
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Solution Overview
Problem
Large confinement apparatuses face challenges in controlling and conditioning electrical and voltage signals due to the need for a significant number of electrical connections, which requires a large surface area and is technically complex, especially for systems with thousands of electrodes.
Innovation Solution
The integration of an ASIC chip with a confinement apparatus chip in a 3D or 2.5D architecture, where the ASIC defines a plurality of electrical channels, allowing each electrode to be in electrical communication with a respective channel, and the ASIC splits and conditions voltage signals to be applied to the electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a significant number of electrical connections are used to provide controlling voltage signals to the ion trap, then individual control of each electrode is achieved, but the surface area required and system complexity increase significantly
Solution Approach 1:
The patent combines the confinement apparatus chip with an ASIC control chip into a single integrated package. The ASIC chip integrates multiple electrical channels and signal conditioning circuits that were previously separate components, reducing the overall number of external electrical connections needed while maintaining individual control capability for each electrode through the integrated control architecture
Solution Approach 2:
The ASIC chip serves multiple functions simultaneously: it provides electrical channels for signal distribution, includes signal conditioning circuits for voltage control, and manages multiple electrodes through a unified control interface. This multi-functional integration reduces the need for separate dedicated connections for each function, thereby reducing overall system complexity while preserving electrode control capability
2Reliability
If traditional packaging is used for confinement apparatus with many electrodes, then all electrical connections can be made, but the package size and surface area increase
Solution Approach 1:
The patent transitions from a traditional planar packaging approach to a three-dimensional integrated package architecture. The confinement apparatus chip and ASIC control chip are stacked vertically with interposers, allowing electrical connections to be made through vertical vias and interlayer connections rather than requiring all connections on a single large planar surface. This dimensional change enables high-density connections with reduced footprint
3Ease of operation
If signal conditioning circuits are placed outside the confinement apparatus package, then control functionality is achieved, but the number of signals to be passed through the cryogenic and vacuum chamber increases
Solution Approach 1:
The patent merges the signal conditioning circuits with the confinement apparatus by integrating them into the ASIC chip within the same package. This combination allows signal conditioning to be performed inside the package, reducing the number of signals that need to be transmitted through the vacuum chamber while maintaining full control functionality for all electrodes
Data Source
AI summary
A confinement apparatus package is provided. The confinement apparatus chip includes a confinement apparatus die having a plurality of electrodes formed thereon, wherein the plurality of electrodes defines a confinement apparatus; an application-specific integrated circuit (ASIC) chip comprising an ASIC die having an ASIC formed thereon; and a package substrate. The ASIC die is disposed between the package substrate and the confinement apparatus die. The ASIC defines a plurality of electrical channels and each electrode of the plurality of electrodes is in electrical communication with a respective electrical channel of the plurality of electrical channels.