Confocal Light Planarization of Photo-Imagable Dielectric Layers
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Solution Overview
Problem
The miniaturization of semiconductor devices poses challenges in packaging due to increasing complexity and the need for precise planarization of substrate surfaces, particularly in minimizing bump height thickness variation caused by underlying dielectric and copper layer thickness variations.
Innovation Solution
The use of a confocal light beam is directed onto a photo-imagable dielectric layer at a defined target Z-height to alter chemical bonds, creating a planar surface by removing undulations through a combination of orbital and translational motion, thereby minimizing thickness variations without mechanical polishing or grinding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mechanical polishing or grinding is used to planarize the substrate surface, then a flat surface can be achieved, but the process complexity and potential damage to underlying layers increase
Solution Approach 1:
The patent replaces mechanical polishing or grinding systems with a photo-imagable dielectric layer processing system that uses light-based methods to achieve planarization. This substitution eliminates the complexity and potential damage associated with mechanical contact while maintaining the ability to create a substantially flat surface for subsequent photolithographic steps.
2Ease of manufacture
If the substrate surface is not planarized, then the manufacturing process is simpler, but photolithographic errors increase due to thickness variations
Solution Approach 1:
The patent applies preliminary planarization processing to the substrate surface before photolithography steps. By creating a substantially flat surface in advance through processing the photo-imagable dielectric layer, the method ensures that subsequent photolithographic operations can proceed with high precision without requiring complex real-time compensation mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively achieves a substantially flat surface with minimal photolithographic errors, enhancing the planarity and reducing thickness variations across the substrate, which is crucial for high-yielding semiconductor devices.
Implementation Method 1
A confocal light beam is directed onto a photo-imagable dielectric layer at a defined target Z-height to alter chemical bonds
Data Source
AI summary
An interlayer dielectric material includes a planar surface that exhibits planarity due to raster-patterned decomposition products due to use of a confocal light beam. The planar surface encompasses a filled via that is in electrical and physical contact with a bond pad that is also on the planar surface.