Conformable Brain Electrode Array with Flexible Substrate
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Solution Overview
Problem
Current electrophysiological measurement devices face challenges in establishing effective contact with complex-shaped biological surfaces like the brain, particularly in areas requiring high bendability, such as between brain hemispheres, while avoiding trauma and immune responses.
Innovation Solution
Development of conformable biomedical devices with a deformable substrate and electrode array, supported by a barrier layer, allowing for conformal contact and electrical communication with brain tissue, enabling spatio-temporal monitoring and actuation without penetrating the tissue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a rigid electrode array is used to ensure stable electrical contact, then measurement precision is improved, but the device cannot conform to complex-shaped biological surfaces like the brain
Solution Approach 1:
The patent employs a flexible substrate as the base layer of the electrode array, allowing the rigid electrode contacts to be mounted on a compliant foundation. This enables the array to conform to the curved and folded surfaces of the brain while maintaining stable electrical contact through the flexible mounting surface.
Solution Approach 2:
The electrode array is designed with the ability to assume curved configurations matching the brain's surface geometry. The flexible substrate allows the planar electrode array to be bent and shaped to conform to the spherical and folded contours of the brain, enabling comprehensive surface contact.
2Measurement precision
If penetrating electrodes are used to achieve direct electrical contact with brain tissue, then measurement precision is improved, but trauma and immune response are caused
Solution Approach 1:
The patent introduces a flexible substrate as an intermediary between the electrode array and the brain tissue. This intermediate layer allows electrical contact to be established through the substrate material itself, eliminating the need for penetrating electrodes while maintaining adequate electrical coupling for measurement.
Solution Approach 2:
The invention replaces the mechanical penetration system (sharp electrodes inserted into tissue) with a compliant contact system where the flexible substrate itself establishes electrical contact through conformal surface contact, substituting mechanical intrusion with mechanical adaptation.
3Adaptability or versatility
If the device is made highly bendable to conform to brain surfaces, then adaptability is improved, but device complexity increases due to the need for deformable electrical interconnects
Solution Approach 1:
The patent uses a flexible substrate that serves as both the structural foundation and the electrical mounting surface. The electrode array is constructed with flexible conductive traces and interconnects that are inherently compliant, allowing the entire assembly to bend without requiring complex articulated joint mechanisms.
Solution Approach 2:
The electrical interconnects are designed with dynamic flexibility, allowing them to deform elastically with the substrate during bending. This dynamic compliance enables the rigid electrode contacts to remain electrically connected through flexible pathways that adapt to changing device configurations.
Data Source
Figure 1A~1B
Figure 1C
Figure 2A~2F
AI summary
Provided are methods and devices for interfacing with brain tissue, specifically for monitoring and/or actuation of spatio-temporal electrical waveforms. The device is conformable having a high electrode density and high spatial and temporal resolution. A conformable substrate supports a conformable electronic circuit and a barrier layer. Electrodes are positioned to provide electrical contact with a brain tissue. A controller monitors or actuates the electrodes, thereby interfacing with the brain tissue. In an aspect, methods are provided to monitor or actuate spatio-temporal electrical waveform over large brain surface areas by any of the devices disclosed herein.