Conformable Composite Heat Sink Pedestal for Multi-Chip Packages

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Solution Overview

Problem

Existing edge devices with fanless cooling systems require complex and time-consuming mechanical adjustments when processor die locations or designs change, especially for multi-chip packages, due to the need for realignment of metal pedestals and thermal interface materials.

Innovation Solution

A conformable heat sink pedestal made of a composite material with a conductivity ratio of lateral to planar thermal conductivity of at least 0.1, which self-conforms to the shape of the processor die, eliminating the need for metal pedestals and conventional thermal interface materials, allowing for efficient heat transfer without realignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal pedestal and thermal interface material are used for heat transfer, then heat dissipation is effective, but mechanical design effort and time to market increase when processor die location or design changes

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidtime to market

Core Design Contradiction:

TemperatureVSLoss of time

Solution Approach 1:

The patent changes the material parameter from rigid metal to compliant polymer composite, enabling the heat sink pedestal to deform and conform to different processor die geometries. This material parameter change allows the same heat sink design to accommodate various processor configurations without mechanical redesign, reducing time to market while maintaining effective heat transfer through the compliant thermal interface

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite material consisting of polymer matrix combined with thermally conductive particles or fillers. This composite structure provides both the mechanical compliance needed to conform to different processor shapes and the thermal conductivity required for effective heat dissipation, eliminating the need for separate metal pedestal and thermal interface material components

Inventive Principle:

Principle #40Composite materials

2Temperature

If a metal pedestal is used to clear interference between components, then heat transfer is efficient, but device complexity increases for multi-chip packages

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidpedestal alignment complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The compliant polymer composite pedestal automatically adapts its shape to conform to the processor die geometry through elastic deformation. This self-conforming capability eliminates the need for complex alignment procedures and manual adjustments that would be required for rigid metal pedestals, significantly reducing device complexity while maintaining thermal contact efficiency

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent utilizes the flexible and deformable nature of the polymer composite material to create a pedestal that can bend and adapt to the specific geometry of multi-chip packages. This flexibility allows the pedestal to clear interference between components naturally through deformation rather than requiring complex mechanical structures or precise alignment mechanisms

Inventive Principle:

Principle #30Flexible shells and thin films

3Temperature

If conventional thermal interface material is used to fill microscopic unevenness, then heat dissipation is effective, but manufacturing precision requirements increase

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidsurface flatness tolerance

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent changes the mechanical parameter of the thermal interface from rigid to compliant by using polymer composite material. This compliance allows the pedestal to deform and fill microscopic surface unevenness automatically through elastic deformation, reducing the stringency of surface flatness tolerance requirements while maintaining effective thermal contact and heat dissipation

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces mechanical design efforts and time to market for IoT edge devices, enabling the reuse of heat sinks across processor generations while maintaining effective heat dissipation, as demonstrated by thermal simulation results comparable to conventional setups.

Implementation Method 1

a heat sink pedestal arranged between the heat sink and the semiconductor chip... The composite material may include a conductivity ratio of lateral thermal conductivity (Kz) to planar thermal conductivity (Kx, Ky) of at least 0.1

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11521911B2Conformable heat sink pedestal for multi-chip packages

Publication Date: 2022.12.06 INTEL CORP

AI summary

The present disclosure relates to a heat sink pedestal including a composite material. The composite material may include at least one layer of a thermally conductive primary material and at least one layer of a thermally conductive secondary material. The composite material may include a conductivity ratio of lateral thermal conductivity (Kz) to planar thermal conductivity (Kx, Ky) of the composite material of at least 0. The heat sink pedestal may be conformable to a shape of a semiconductor chip.