Conformable Metallic EMI Shielding Layer for Miniaturized IC Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional EMI shielding in semiconductor devices using metal lids is not suitable for miniaturized, highly integrated devices due to their large form factor, which is a challenge for mobile applications.
Innovation Solution
A conformable metallic layer is formed on top of a photosensitive molding within the integrated circuit structure, replacing the traditional metal lid, and is connected to local circuit ground to provide effective EMI shielding with a smaller form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal piecepart lid is used for EMI shielding, then effective electromagnetic interference protection is achieved, but the form factor becomes large and unsuitable for miniaturized devices
Solution Approach 1:
The patent replaces the mechanical metal piecepart lid with a conformal metallic layer deposited directly onto the molding. This substitution eliminates the need for a separate mechanical shielding component, reducing the overall form factor while maintaining EMI protection functionality through direct integration into the package structure.
Solution Approach 2:
The patent employs a thin metallic layer deposited conformally over the molding surface, replacing the bulky metal lid. This thin film approach provides effective EMI shielding with minimal thickness, enabling miniaturization of the device while preserving electromagnetic interference protection.
2Reliability
If a metal piecepart lid is used for EMI shielding, then electromagnetic interference protection is provided, but the device complexity increases due to additional assembly steps
Solution Approach 1:
The patent merges the EMI shielding function with the existing molding structure by depositing a conformal metallic layer directly onto it. This integration combines multiple functions into a single component, eliminating the need for separate assembly of a metal lid and reducing overall device complexity.
Solution Approach 2:
The molding structure serves dual purposes: as the package encapsulation and as the substrate for the EMI shielding layer. This multi-functional design eliminates the need for dedicated EMI shielding components, simplifying the overall device architecture and assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the form factor of EMI shielding, making it suitable for highly integrated devices like those used in mobile applications while maintaining effective electromagnetic interference protection.
Implementation Method 1
a conformable metallic layer is deposited over the first side of the substrate and in the via
Data Source
AI summary
An integrated circuit structure includes a substrate, a photosensitive molding on a first side of the substrate, a via formed in the molding, and a conformable metallic layer deposited over the first side of the substrate and in the via. A through via may be formed through the substrate aligned with the via in the molding with an electrically conductive liner deposited in the through via in electrical contact with the conformable metallic layer. The integrated circuit structure may further include a connector element such as a solder ball on an end of the through via on a second side of the substrate opposite the first side. The integrated circuit structure may further include a die on the first side of the substrate in electrical contact with another through via or with a redistribution layer.