Conformal Array Antenna Laser Ablation Reduction
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Solution Overview
Problem
Conventional methods for forming patterned conductive circuits on radar antennas, such as those described in Japanese Patent Application Publication No. 2004-193937A, are inefficient and costly due to the long operating time of laser ablation machines, especially for larger substrates, which increases manufacturing time and cost.
Innovation Solution
A method involving a non-conductive substrate with a curved surface that is roughened by blasting particles, followed by the formation of an activation layer and a first metal layer through chemical plating, with antenna pattern regions defined by isolating gaps along the outer periphery, reducing the need for extensive laser ablation and thus shortening manufacturing time and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser ablation is used to remove the conductive copper layer outside of the antenna pattern region, then the antenna pattern can be formed, but the operating time of the laser ablation machine becomes long, especially for large-sized substrates
Solution Approach 1:
The patent applies preliminary action by forming a resist layer with predefined antenna pattern regions before depositing the conductive copper layer. This allows the antenna pattern to be pre-established through masking, so that subsequent laser ablation only needs to remove copper from non-pattern areas rather than defining the entire pattern, significantly reducing laser operating time for large substrates
Solution Approach 2:
The patent segments the pattern formation process into two distinct stages: (1) resist layer patterning that defines the antenna pattern regions, and (2) copper layer deposition and selective removal. This segmentation allows the time-consuming laser ablation to be minimized to only the copper removal step, while the pattern definition is handled by the resist layer
2Manufacturing precision
If laser ablation is used to remove the conductive copper layer outside of the antenna pattern region, then the antenna pattern can be formed, but the manufacturing cost increases
Solution Approach 1:
The resist layer is prepared in advance with the antenna pattern regions defined, serving as a mask that guides subsequent copper deposition and removal. This preliminary patterning reduces the complexity and cost of laser ablation operations, as the machine only needs to perform selective removal rather than complex pattern definition, thereby lowering manufacturing costs
Solution Approach 2:
The resist layer acts as an intermediary element that facilitates pattern transfer from the mask to the copper layer. This intermediary approach simplifies the manufacturing process by decoupling pattern definition from material removal, making the overall process more cost-effective and easier to manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method efficiently forms conformal array antennas by uniformly roughening the substrate, enhancing coupling strength, and reducing the operating time and cost of laser ablation, making it suitable for larger substrates by isolating antenna patterns efficiently.
Implementation Method 1
blasting a plurality of particles onto the curved surface of the substrate to roughen the curved surface
Implementation Method 2
forming a first metal layer on the activation layer by chemical plating process
Data Source
AI summary
A conformal array antenna includes a substrate and a conductive circuit. The substrate has a non-conductive roughened curved surface formed with a plurality of hook-shaped structures that are formed by blasting a plurality of particles on the substrate. The non-conductive roughened curved surface defines a plurality of spaced-apart antenna pattern regions. The conductive circuit is located in the antenna pattern regions, and includes an activation layer formed on the roughened curved surface and containing an active metal, and a first metal layer formed on the activation layer.