Conformal Block Layer Layout for Miniaturized Optical Sensors
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Solution Overview
Problem
The miniaturization of optical devices is hindered by the large predetermined distance required between components due to the injection molding technique used in forming plastic lids, which affects the size and efficiency of Time of Flight (ToF) sensors.
Innovation Solution
The optical device incorporates a block layer conformally disposed over a transparent element, with the block layer's dimensions defined by the transparent element's protruded portions, eliminating the need for a predetermined distance between the block layer and the transparent element, thus allowing for reduced size and improved miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If injection molding technique is used to form plastic lid, then manufacturing process is simple, but predetermined distance between components must be maintained which increases device size
Solution Approach 1:
The patent changes the manufacturing parameter from injection molding to deposition process, allowing the block layer to be formed conformally over the transparent element without requiring predetermined distance, thus reducing device size while maintaining manufacturing feasibility
Solution Approach 2:
The transparent element is formed with protruded portions in advance, which then define the boundaries for the block layer deposition. This preliminary structuring eliminates the need for process tolerance distance that would otherwise be required in injection molding
2Reliability
If predetermined distance is maintained for process tolerance, then manufacturing reliability is improved, but miniaturization of optical device is adversely affected
Solution Approach 1:
The patent changes the manufacturing approach from injection molding with fixed distance requirements to conformal deposition where the block layer follows the contour of the transparent element, eliminating the need for process tolerance distance and enabling miniaturization
Solution Approach 2:
The patent replaces the mechanical injection molding process with a deposition process, allowing the block layer to be formed conformally over the transparent element without requiring predetermined distance, thus achieving miniaturization while maintaining manufacturing reliability
Data Source
AI summary
An optical device includes an emitter, a receiver, a transparent element, and a block layer. The transparent element is disposed over the emitter and the receiver. The transparent element defines a recess between the emitter and the receiver. The block layer is conformally disposed over the transparent element and the recess.