Conformal Cooling Assembly for Non-Uniform Multi-Die Heat Control
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Solution Overview
Problem
Conventional liquid-cooled cold plates struggle to effectively manage heat in multi-die electronic assemblies due to non-uniform die heights, die deflections, and local hot spots, leading to reduced computational performance and potential device failure.
Innovation Solution
A conformal cooling assembly is introduced, comprising a conformal cooling module with inlet and outlet passageways, a fastener for attachment to the substrate, and a fluid-barrier to prevent coolant penetration into the substrate. This design allows for direct fluid contact with heat-generating components, effectively managing heat across varying die heights and deflections while preventing fluid exposure to sensitive electronics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat cold plate is used for cooling, then thermal contact is achieved on uniform surfaces, but cooling effectiveness is reduced on multi-die assemblies with non-uniform die heights and deflections
Solution Approach 1:
The patent employs a conformal cooling module with a flexible membrane that can deform to match the non-planar surface topology of multi-die assemblies. The membrane's ability to curve and adapt its shape allows continuous thermal contact with dies of varying heights and deflections, resolving the contradiction between maintaining reliable thermal contact and adapting to non-uniform surfaces.
Solution Approach 2:
The flexible membrane in the cooling module can dynamically adjust its shape in response to the underlying die topography. This dynamic adaptation enables the cooling surface to conform to changing die heights and deflections, maintaining effective thermal contact across non-uniform surfaces while preserving cooling reliability.
2Temperature
If cooling fluid is allowed to contact heat-generating components directly, then thermal management is improved, but fluid penetration and absorption by the substrate causes harmful effects
Solution Approach 1:
The patent segments the cooling system into distinct functional zones: a plenum chamber for fluid distribution, a membrane-separated contact region for thermal management, and a protected substrate area. This segmentation allows direct fluid contact with heat-generating components in the plenum while preventing fluid penetration into the substrate through the membrane barrier, thus resolving the contradiction between effective cooling and preventing harmful fluid absorption.
Solution Approach 2:
The flexible membrane acts as an intermediary element between the cooling fluid and the substrate. It allows thermal energy to pass through while blocking direct fluid contact with the substrate, enabling effective heat removal from components while preventing harmful fluid absorption and contamination of the substrate.
3Productivity
If multiple dies are placed on a single electronic assembly, then processing performance is improved, but thermal management challenges increase due to non-uniform heat distribution
Solution Approach 1:
The conformal cooling module with flexible membrane provides locally adapted cooling to each die based on its specific heat generation characteristics and surface topology. The membrane can deform to ensure optimal thermal contact with each individual die, allowing customized cooling zones that address local hot spots and non-uniform heat distribution while maintaining high processing performance across multiple dies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conformal cooling assembly provides enhanced thermal management by minimizing thermal resistance and reducing operating temperatures in multi-die electronic assemblies, thereby extending device lifespan and improving performance.
Implementation Method 1
Heat flows from the component, through the TIM, spreads through the plate via conduction, and is removed by a liquid coolant flowing through the internal passages or channels of the cold plate
Implementation Method 2
Heat flows from the component, through the TIM, spreads through the plate via conduction, and is removed by a liquid coolant flowing through the internal passages or channels of the cold plate
Data Source
AI summary
A conformal cooling assembly for multiple-die electronic assemblies, such as printed circuit boards, integrated circuits, etc., which addresses and solves a multitude of challenges and problems associated with using liquid-cooled cold plates and dielectric immersion cooling to manage the heat produced by a multiplicity of dies. The conformal cooling assembly comprises a conformal cooling module comprising inlet and outlet passageways and a plenum configured to permit a cooling fluid to pass therethrough, thereby facilitating direct fluid contact with heat-generating components affixed to the substrate of the electronic assembly. The conformal cooling assembly also includes a fastener for attaching the conformal cooling module to the substrate; and a fluid-barrier disposed between the substrate and the plenum. The fluid-barrier is adapted to minimize, inhibit or prevent the cooling fluid from penetrating and being absorbed by the substrate.