Conformal Cooling Structure for Power Electronics Thermal Management

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Solution Overview

Problem

Conventional cooling arrangements for heat-emitting devices, such as high power density power electronic components, are inefficient due to thick, stacked layers that increase thermal resistance and bulk, limiting heat transfer efficiency to only the top and bottom surfaces, while neglecting heat emission from sides and other exposed surfaces.

Innovation Solution

A continuous conformal cooling structure with a thermally-conductive, electrically-insulative layer and metallization layers is applied directly to the heat-emitting device and substrate, covering all surfaces to facilitate heat transfer in all directions while preventing electrical shorts and protecting against moisture and contaminants.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thick, separately formed and stacked layers comprising insulation, spacers and heat spreaders are used, then electrical insulation is provided, but thermal resistance increases and heat transfer efficiency decreases

Engineering Contradiction:

Improveelectrical insulationVSAvoidheat transfer efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent merges the insulation layer and heat spreader into a single integrated structure. The insulative layer with embedded metallization layers serves both as an electrical insulator and as a heat spreading component, eliminating the need for separate stacked layers and reducing thermal resistance.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention uses composite material structure where an insulative layer (such as ceramic or polymer) is combined with metallization layers (such as copper or aluminum) to create a material that provides both electrical insulation and thermal conduction properties simultaneously.

Inventive Principle:

Principle #40Composite materials

2Reliability

If thick, separately formed and stacked layers are used, then electrical insulation is provided, but the bulk of the assembly increases

Engineering Contradiction:

Improveelectrical insulationVSAvoidassembly bulk

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If cooling is provided only at top-most and bottom-most surfaces, then manufacturing is simplified, but heat removal from sides and exposed surfaces is neglected

Engineering Contradiction:

Improvecooling structure fabricationVSAvoidheat removal efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent transitions from two-dimensional cooling (top and bottom surfaces only) to three-dimensional cooling by embedding metallization layers within the insulative layer that extend along the sides and exposed surfaces of the semiconductor device, enabling heat removal in multiple directions.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The cooling structure is segmented into multiple metallization layers embedded at different positions within the insulative layer, with each layer serving specific cooling functions for different surfaces of the device, allowing targeted heat removal from various regions.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances heat transfer efficiency by covering all surfaces of the heat-emitting device, including sides and exposed areas, reducing thermal resistance and preventing damage from moisture and contaminants, thereby improving cooling performance and extending the assembly's operational lifespan.

Implementation Method 1

a thermally-conductive, electrically-insulative layer adhering directly to surfaces of the at least one heat generating device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

An inner metallization layer may be adhered directly to surfaces of at least a portion of the insulative layer. An outer metallization layer may be adhered directly to surfaces of the inner metallization layer to provide a thermally conductive layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10424528B2Layered cooling structure including insulative layer and multiple metallization layers

Publication Date: 2019.09.24 TOYOTA JIDOSHA KK

AI summary

An assembly includes at least one heat emitting device and a continuous conformal cooling structure adhering directly to and conforming with surfaces of at least a portion of the at least one heat emitting device. The cooling structure may include a thermally-conductive, electrically-insulative layer adhering directly to surfaces of the at least one heat generating device to provide an electrically nonconductive, continuous, conformal layer covering all such surfaces. An inner metallization layer may be adhered directly to surfaces of at least a portion of the insulative layer. An outer metallization layer may be adhered directly to surfaces of the inner metallization layer to provide a thermally conductive layer covering such surfaces.