Conformal EMI Shielding Layer on Semiconductor Encapsulant
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Solution Overview
Problem
Semiconductor device packages face challenges with electromagnetic interference (EMI) due to high clock speeds and smaller sizes, leading to increased electromagnetic emissions, and existing shielding solutions like conductive casings are prone to peeling and require precise matching, increasing manufacturing costs and time.
Innovation Solution
A semiconductor device package design featuring a circuit substrate, encapsulant, and conductive layer where the encapsulant has a thinner peripheral portion and openings exposing pads, allowing a conformal conductive layer to connect to the substrate, providing EMI shielding without an extra casing, and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductive casing is used for EMI shielding, then EMI protection is improved, but manufacturing complexity and cost increase due to precise alignment requirements
Solution Approach 1:
The conductive shielding layer is integrated directly into the encapsulant structure, merging the shielding function with the existing packaging component. This eliminates the need for a separate conductive casing and its associated alignment requirements, while maintaining EMI protection through the conformal conductive layer deposited on the encapsulant.
Solution Approach 2:
The encapsulant serves multiple functions: it provides mechanical protection, electrical insulation, and now also serves as the substrate for the conductive shielding layer. This multi-functionality reduces the number of separate components needed and simplifies manufacturing by eliminating precise alignment requirements between separate parts.
2Object-affected harmful factors
If a conductive casing is used for EMI shielding, then EMI protection is improved, but manufacturing time increases due to adhesive application and alignment
Solution Approach 1:
The shielding function is merged into the encapsulant fabrication process itself. The conductive layer is deposited conformally during the encapsulant manufacturing, eliminating subsequent steps of applying adhesive and aligning separate casing components, thereby reducing manufacturing time.
Solution Approach 2:
The conductive shielding layer is formed in advance as part of the encapsulant structure before final assembly. This preliminary integration of the shielding function into the encapsulant eliminates time-consuming alignment and bonding operations that would otherwise be required.
3Object-affected harmful factors
If different package sizes require different casings, then EMI shielding effectiveness is maintained, but manufacturing cost increases
Solution Approach 1:
The encapsulant serves as a universal platform that can be adapted to different package sizes while maintaining the shielding function. The conductive layer is deposited conformally on whatever encapsulant size is used, eliminating the need for size-specific casings and reducing manufacturing cost through standardization.
Solution Approach 2:
Rather than changing the fundamental shielding structure for different package sizes, the solution changes the size parameter of the encapsulant itself. The conductive shielding layer adapts automatically to the encapsulant dimensions through conformal deposition, maintaining EMI effectiveness across different package sizes without requiring different casing designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces EMI by establishing a grounded electrical path within the package, enhancing shielding efficacy and reliability while simplifying manufacturing by eliminating the need for precise casing alignment and adhesive-based attachment.
Implementation Method 1
When electromagnetic emissions from an interior of the package strike an inner surface of the casing, at least a portion of these emissions can be electrically shorted, thereby reducing the level of emissions that can pass through the casing
Data Source
AI summary
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a circuit substrate, an electronic device, an encapsulant, and a conductive layer. The substrate includes a carrying surface, an opposing bottom surface, and a pad. The device is disposed adjacent to the carrying surface and is electrically connected to the substrate. The encapsulant is disposed adjacent to the carrying surface, encapsulates the device, and includes a center portion and a surrounding peripheral portion that is less thick than the center portion. An opening exposing the pad is formed in the peripheral portion. The conductive layer conformally covers the encapsulant and traverses the opening to connect to the pad.