Conformal Film Coating for Sensor Environmental Protection
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Solution Overview
Problem
Conventional methods of protecting electronic devices from external environments, such as water and gas, by filling package cavities with gel increase device size and cost, and can impair performance over time.
Innovation Solution
A conformal film, made from materials like Parylene or polymers with glass or ceramic powder, is deposited on the device after assembly to prevent exposure to external environments without enlarging the package dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the package cavity is increased and filled with gel to protect the electronic device from external environment, then the protection from water and gas is improved, but the package size increases
Solution Approach 1:
The patent applies a conformal film coating on the package cavity surfaces instead of using bulk gel. This thin film provides environmental protection while maintaining a compact package size, directly resolving the contradiction between protection and size.
Solution Approach 2:
The patent extracts the protective function from the bulk gel material and implements it through a thin conformal film coating. This removes the unnecessary volume associated with gel filling while retaining the essential protection function.
2Reliability
If the package cavity is filled with gel to protect the electronic device, then the protection from external environment is improved, but the manufacturing cost increases
Solution Approach 1:
The conformal film coating process is more cost-effective than gel filling. The thin film can be applied through standard deposition techniques, reducing material costs and simplifying the manufacturing process while achieving the same protective function.
Solution Approach 2:
By extracting the protective function from expensive bulk gel material and implementing it through a thin conformal film, the patent reduces material costs and manufacturing complexity while maintaining protection effectiveness.
3Reliability
If the package cavity is filled with gel to protect the electronic device, then the protection from external environment is improved, but the performance of the device deteriorates over time due to aging
Solution Approach 1:
The conformal film coating provides a stable protective barrier that does not undergo the same aging degradation as gel materials. The film maintains its protective properties over time, ensuring long-term device performance stability.
Solution Approach 2:
By removing the gel filling material that is subject to aging, the patent eliminates the source of performance degradation over time while maintaining the essential protection function through the stable conformal film coating.
4Reliability
If the package cavity is filled with gel to protect the electronic device, then the protection from external environment is improved, but the electronic device becomes susceptible to damage during mounting due to added mass
Solution Approach 1:
The conformal film coating adds negligible mass compared to bulk gel filling. This thin protective layer provides environmental protection without significantly increasing device weight, making the device less susceptible to mounting damage.
Solution Approach 2:
By extracting the protective function from heavy bulk gel material and implementing it through a thin conformal film, the patent dramatically reduces the added mass while maintaining the protection function, thereby reducing susceptibility to mounting damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conformal film effectively waterproofs and protects electronic devices from liquids and gases, maintaining performance and reducing manufacturing costs by simplifying the process and avoiding the use of gel, while allowing for miniaturization.
Implementation Method 1
a conformal film is deposited on the electronic device or the desired components in order to protect the electronic device or the desired components from being exposed to the external environment
Data Source
AI summary
A device includes a die comprising a sensor. The device also includes a substrate that is coupled to the die via the electrical coupling. The device further includes a packaging container. The packaging container and the substrate form a housing for the die. The packaging container comprises an opening that exposes at least a portion of the die to an environment external to the housing. The exposed surfaces of the die, interior of the housing, the electrical coupling, and the substrate to the environment external to the housing through the opening are coated with a conformal film. The conformal film prevents liquid, e.g., water, gas, etc., contact to the exposed surfaces of the die, the electrical coupling and the substrate.