Conformal Electromagnetic Shielding via Flexible Printed Circuit Films
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Solution Overview
Problem
Existing technologies fail to produce truly flexible or conformal elements on three-dimensional surfaces, particularly for electromagnetic shielding and touch-sensitive films, due to the difficulty in forming conformal films or elements, which leads to non-uniform shielding performance and high manufacturing costs.
Innovation Solution
A method involving the formation of a formable element with a network of high aspect ratio molecular structures (HARM-structures) that can be conformally arranged onto a three-dimensional surface using pressing and/or vacuum sealing, creating a conformal and electrically conductive or semi-conductive element with enhanced flexibility and shielding capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional non-conformal shielding methods (Faraday Cages) are used, then electromagnetic shielding is achieved, but the shielding performance becomes non-uniform and manufacturing costs increase
Solution Approach 1:
The patent uses flexible printed circuit board (FPC) as a thin film substrate to carry conductive traces, replacing traditional rigid Faraday cage structures. This allows the shield to conform to complex three-dimensional surfaces while maintaining uniform shielding performance and reducing manufacturing complexity
Solution Approach 2:
The patent transitions from three-dimensional volumetric shielding (Faraday cages) to two-dimensional surface conformal shielding using FPC traces. This dimensional reduction allows the shield to wrap around complex surfaces more efficiently, achieving uniform coverage without the complexity of volumetric structures
2Reliability
If conformal films are formed on three-dimensional surfaces, then flexible and uniform shielding is achieved, but the difficulty of forming conformal films increases
Solution Approach 1:
The patent pre-forms the FPC substrate with conductive traces on a flat surface before conforming it to the three-dimensional target surface. This preliminary fabrication on a convenient substrate simplifies the manufacturing process and enables easy conformal application to complex geometries
Solution Approach 2:
The patent uses flexible printed circuit board material that can dynamically conform to different three-dimensional surfaces. The FPC can be bent, shaped, and adapted to various geometries while maintaining its conductive properties and shielding effectiveness
3Reliability
If rigid metal cages are used for electromagnetic shielding, then shielding is achieved, but the structure takes up significant space and is expensive to manufacture
Solution Approach 1:
The patent replaces volumetric metal cages with thin FPC traces that can be applied directly to surfaces. This reduces the shield volume from three-dimensional enclosure to two-dimensional surface layer, significantly reducing space requirements while maintaining shielding effectiveness
Solution Approach 2:
The patent extracts only the essential shielding function from traditional Faraday cages, implementing it through thin conductive traces on FPC rather than complete volumetric enclosures. This selective approach maintains necessary shielding performance while eliminating excess material and volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of flexible and conformal touch-sensitive films and electromagnetic shields with improved conductivity and reduced manufacturing costs, allowing for efficient shielding and flexible integration on complex structures while maintaining performance across the entire surface.
Implementation Method 1
a) forming a formable element comprising one or more layers, wherein at least one layer comprises a network of high aspect ratio molecular structures (HARM-structures), wherein the HARM-structures are electrically conductive or semi-conductive
Implementation Method 2
b) arranging the formable element in a conformal manner onto a structure by pressing and/or vacuum sealing the formable element on a three-dimensional surface of the structure
Implementation Method 3
b) arranging the formable element in a conformal manner onto a structure by pressing and/or vacuum sealing the formable element on a three-dimensional surface of the structure
Data Source
Figure 1a~2
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Figure 6a~8
AI summary
The invention relates to a method for the production of an at least partially electrically conductive or semi-conductive element on a structure, wherein the element comprises one or more layers, the method comprising the steps of a) forming a formable element comprising one or more layers, wherein at least one layer comprises a network of high aspect ratio molecular structures (HARM-structures), wherein the HARM-structures are electrically conductive or semi-conductive, and b) arranging the formable element in a conformal manner onto a structure by pressing and/or vacuum sealing the formable element on a three-dimensional surface of the structure, for producing a conformal and at least partially electrically conductive or semi-conductive element comprising one or more layers, wherein at least one layer comprises a network of HARM-structures, on the three dimensional surface of the structure. Further, the invention relates to a conformal element and uses thereof.