Conformal Heat Spreader Protrusions for Semiconductor Die Thermal Management
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Solution Overview
Problem
The increasing heat generation in small, high-powered semiconductor devices with multiple co-packaged die poses challenges for thermal management due to obstructed thermal paths and inefficient heat dissipation, leading to elevated temperatures and potential device malfunction.
Innovation Solution
The use of a conformal heat spreader with internally-facing protrusions that reduce the distance between the die and the heat spreader, enhancing thermal conductivity by increasing the heat spreader's surface area and improving the thermal path through reduced thermal interface material volume, and optionally contacting thermal dissipation pads for further heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the device size is reduced to achieve smaller semiconductor devices, then miniaturization goals are met, but heat dissipation efficiency deteriorates due to obstructed thermal paths
Solution Approach 1:
The patent introduces vertically-oriented thermal conduction paths through the substrate thickness dimension, transitioning from traditional lateral heat dissipation to three-dimensional thermal management. Heat dissipation structures extend through the substrate thickness to surface regions, creating vertical thermal pathways that bypass lateral obstructions and efficiently conduct heat from deep within the miniaturized device to the surface for dissipation.
2Power
If higher operating power consumption is achieved to provide greater functionality and speed, then performance goals are met, but internal heat generation increases
Solution Approach 1:
The patent introduces thermal conduction pathways and heat dissipation structures as intermediary elements between the heat-generating active regions and the device exterior. These intermediaries include thermally conductive materials and vertically-oriented heat dissipation structures that mediate heat transfer, providing efficient thermal pathways that allow high power operation while managing the resulting heat generation through structured thermal management.
3Device complexity
If traditional lateral heat dissipation paths are used in miniaturized devices, then structural simplicity is maintained, but heat dissipation efficiency deteriorates due to obstructed thermal paths
Solution Approach 1:
The patent segments the heat dissipation function into distinct vertical zones within the substrate thickness. Heat dissipation structures are positioned at specific depths and extend toward the surface, creating segmented thermal pathways that systematically conduct heat from different regions of the device. This segmentation allows efficient heat management while maintaining relatively simple overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively enhances heat dissipation from semiconductor die stacks by reducing the distance heat must travel and improving thermal conductivity, preventing overheating and ensuring device performance.
Implementation Method 1
enhancing thermal conductivity by increasing the heat spreader's surface area and improving the thermal path
Data Source
AI summary
Apparatuses and methods for semiconductor die heat dissipation are described. For example, an apparatus for semiconductor die heat dissipation may include a substrate and a heat spreader. The substrate may include a thermal interface layer disposed on a surface of the substrate, such as disposed between the substrate and the heat spreader. The heat spreader may include a plurality of substrate-facing protrusions in contact with the thermal interface layer, wherein the plurality of substrate-facing protrusions are disposed at least partially through the thermal interface layer.