Conformal Insulating Layer for EMI Shielding

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Solution Overview

Problem

Current processes for electromagnetically shielding electronic devices in packages are time-consuming and limited by the thickness of the epoxy mold compound, which restricts the minimum spacing between components, leading to larger package sizes.

Innovation Solution

A method involving a substrate with conductor pads and electronic components, where a thin conformal insulating layer is formed and then partially removed using excimer laser ablation to expose the pads, allowing for the direct formation of an electrically conductive EMI layer, which can be integrated with the components and reduce package size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a thick epoxy mold compound is used for EMI shielding, then EMI shielding effectiveness is improved, but package size increases and manufacturing time increases

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidpackage size

Core Design Contradiction:

Object-affected harmful factorsVSVolume of stationary object

Solution Approach 1:

The patent divides the EMI shielding function into multiple thin conductive layers deposited on the surface of the mold compound, rather than using a single thick shielding layer. This segmentation allows effective EMI shielding while maintaining a compact package size, as the thin surface layers provide sufficient shielding without adding significant volume.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses composite material structures combining the epoxy mold compound with thin metal conductive layers deposited on its surface. This composite approach leverages the dielectric properties of the epoxy and the conductive properties of the thin metal layers to achieve effective EMI shielding with minimal increase in package size.

Inventive Principle:

Principle #40Composite materials

2Object-affected harmful factors

If a thick epoxy mold compound is used for EMI shielding, then EMI shielding effectiveness is improved, but manufacturing time increases

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidmanufacturing time

Core Design Contradiction:

Object-affected harmful factorsVSLoss of time

Solution Approach 1:

The patent extracts the EMI shielding function from the bulk epoxy mold compound and implements it as thin conductive surface layers. This extraction eliminates the need for thick shielding layers within the epoxy, reducing the overall manufacturing time while maintaining EMI shielding effectiveness through the surface-deposited conductive materials.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical approach of inserting thick shielding materials into the epoxy mold compound with a deposition process that applies thin conductive layers on the surface. This substitution of the shielding implementation method significantly reduces manufacturing time while achieving the same EMI shielding goal.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Object-affected harmful factors

If thick epoxy mold compound is used, then EMI shielding is effective, but minimum spacing between components is increased

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidspacing between components

Core Design Contradiction:

Object-affected harmful factorsVSLength of moving object

Solution Approach 1:

The patent transitions the EMI shielding approach from a three-dimensional bulk shielding structure within the epoxy to a two-dimensional surface layer configuration. By depositing thin conductive layers on the epoxy surface, the shielding function is achieved without increasing the spacing between components, as the shielding occurs at the surface level rather than requiring volumetric separation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing time and package size by minimizing the thickness of the insulating layer and the spacing between components, while maintaining effective EMI shielding.

Implementation Method 1

partially removed using excimer laser ablation to expose the pads

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

an electrically conductive material can be deposited onto an exposed molded surface of the package to create an EMI shield layer

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS10224290B2Electromagnetically shielded electronic devices and related systems and methods

Publication Date: 2019.03.05 INTEL CORP

AI summary

Electromagnetically shielded electronic device technology is disclosed. In an example, a method of making an electronic device package can comprise providing a substrate having a conductor pad and an electronic component. The method can also comprise forming a conformal insulating layer on the substrate and electronic component. The conformal insulating layer conforms to the electronic component. The method can further comprise exposing the conductor pad. In addition, the method can comprise forming an electrically conductive electromagnetic interference (EMI) layer on the insulating layer and in contact with the conductor pad.