Conformal Manufacturing Device for Curved-Surface Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current manufacturing technologies for complex curved-surface electronic systems face challenges in precise positioning, reliable peeling of flexible components, accurate transfer printing to curved surfaces, and efficient conductive interconnection due to limitations in 2D visual positioning, slow measurement efficiency, and incompatibility with high-viscosity nano-silver pastes.
Innovation Solution
A conformal manufacturing device with a spherical motor linkage platform, 3D measurement module, laser lift-off module, curved-surface transfer printing module, and conformal jet printing module, which enables high-precision, automated manufacturing of rigid or flexible curved-surface electronic components by integrating 3D laser point cloud scanning, active-passive transfer printing, and air sheath-assisted jet printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional 2D visual positioning method is used, then positioning process is simple, but 3D positioning requirement of curved-surface electronic system cannot be satisfied
Solution Approach 1:
The patent transitions from 2D visual positioning to 3D laser scanning positioning by introducing a third dimension (depth/Z-axis) to the positioning system. The laser scanning device captures three-dimensional coordinate data of the curved surface, enabling precise positioning in 3D space while maintaining operational simplicity through automated scanning and processing.
2Measurement precision
If CMM coordinate measurement machine is used to measure curved surface point by point, then measurement coverage is complete, but measurement efficiency is slow and data processing is slow
Solution Approach 1:
The patent replaces the mechanical point-by-point CMM measurement system with an optical laser scanning system. The laser scanning device uses optical fields to non-contactly measure the entire curved surface rapidly, capturing three-dimensional coordinate data through laser projection and reception, thereby dramatically improving measurement efficiency while maintaining measurement completeness.
3Ease of manufacture
If thimble peeling technology is used to break microelectronic component and substrate at boundary, then peeling process is simple, but it cannot meet peeling requirements of flexible electronic substrate with high reliability and high compatibility
Solution Approach 1:
The patent replaces the mechanical thimble peeling method with a laser-based peeling system. The laser peeling device uses optical energy to selectively separate the flexible electronic substrate from the planar substrate through controlled laser irradiation, avoiding mechanical damage while achieving reliable and compatible peeling for flexible substrates.
Solution Approach 2:
The patent changes the peeling mechanism from mechanical force application to optical energy parameter control. By adjusting laser parameters such as power density, pulse duration, and scanning speed, the system achieves precise control over the peeling process, enabling reliable separation of flexible substrates without mechanical damage.
4Ease of manufacture
If mechanical-control transfer printing or surface relief-assisted transfer printing is used, then transfer printing process is simple, but it cannot realize plane-to-curved-surface transfer printing with high precision
Solution Approach 1:
The patent introduces a spherical motor linkage platform that adds rotational freedom in multiple dimensions to the transfer printing system. This enables the platform to adapt its orientation and position to match the curved surface geometry, achieving high-precision plane-to-curved-surface transfer printing while maintaining process simplicity through automated positioning.
Solution Approach 2:
The patent employs a dynamic spherical motor linkage platform that can continuously adjust its pose to conform to the curved substrate surface. This dynamic adaptation allows the transfer printing system to maintain optimal contact and positioning throughout the transfer process, achieving high precision for curved surface applications.
5Ease of manufacture
If conventional inkjet printing technology is used to print patterns on curved surface, then printing process is simple, but it cannot meet jet printing of high-viscosity nano-silver paste material with viscosity of 3000-10000 cps
Solution Approach 1:
The patent modifies the inkjet printing system parameters to accommodate high-viscosity nano-silver paste. By adjusting printing head pressure, nozzle diameter, scanning speed, and temperature control, the system achieves successful jet printing of materials with viscosity of 3000-10000 cps, expanding the adaptability of the printing process to different material viscosities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-precision, high-efficiency manufacturing of complex curved-surface electronic systems, overcoming limitations in existing technologies by ensuring accurate positioning, reliable peeling, precise transfer printing, and effective conductive interconnection, suitable for mass production of applications like aerospace smart skin and flexible sensors.
Implementation Method 1
a three-dimensional (3D) measurement module, a laser lift-off module
Implementation Method 2
a 3D laser measurement sensor configured to perform point cloud acquisition on the curved-surface substrate
Implementation Method 3
a laser configured to emit laser radiation through a matched optical path portion, thereby peeling off an electronic component lithographically printed on a transparent rigid planar substrate from the planar substrate
Implementation Method 4
laser radiation thereby peeling off
Implementation Method 5
a conformal jet printing module, a nozzle portion continuously installed on the jet printing module planar motion portion, and configured to continuously jet-print a paste on a surface of the curved-surface substrate
Data Source
AI summary
The invention belongs to a related field of electronic manufacturing technology, and particularly relates to a conformal manufacturing device and a method for a complex curved-surface electronic system, the system includes a support platform and a six-degree-of-freedom spherical motor linkage platform, a 3D measurement module, a laser lift-off module, a curved-surface transfer printing module and a conformal jet printing module respectively mounted on the support platform and independently controllable, and specific structures and work modes of these key components are improved. The invention further discloses a corresponding manufacturing method. Through the invention, multiple process flows required in conformal manufacturing process of the complex curved-surface electronic system are effectively integrated into an integrated device, so as to realize conformal hybrid manufacturing of the rigid/flexible curved-surface electronic system with arbitrary area, and the invention has advantages of high precision, high efficiency and high automation, which greatly broadens the application scope of the curved-surface electronic manufacturing technology.