Conformal Memory Heatsink with Cold Plate Projections
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Solution Overview
Problem
Memory modules in information handling systems generate significant heat, making it challenging to provide adequate cooling due to limited space for traditional heatsinks and restricted airflow.
Innovation Solution
A circuit board with memory module sockets, heatsinks between adjacent memory modules, and a cold plate with projections that extend into the gaps between heatsinks, allowing for efficient heat dissipation through thermal coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heatsinks are used on memory modules, then heat dissipation capability is improved, but the form factor constraints and limited space prevent adequate cooling
Solution Approach 1:
The cooling system is divided into modular components: individual heatsinks attached to each memory module and a separate cold plate with multiple contact points. This segmentation allows the cooling solution to be distributed across the limited space rather than requiring one large heatsink, resolving the contradiction between heat dissipation capability and available space.
Solution Approach 2:
The heatsinks are positioned between adjacent memory modules, nesting the cooling structure within the existing form factor constraints. The cold plate then contacts the heatsinks from the opposite side, creating a nested arrangement that maximizes heat transfer surface area without increasing the overall footprint of the memory module assembly.
2Adaptability or versatility
If memory modules are arranged in typical configurations, then system integration is improved, but airflow between modules is restricted
Solution Approach 1:
The heatsinks act as intermediary structures positioned between adjacent memory modules. They provide thermal conduction pathways while maintaining the typical memory module arrangement for system integration. The heatsinks facilitate heat transfer without requiring changes to the overall system layout, thus preserving adaptability while improving cooling.
3Temperature
If heatsinks are placed between adjacent memory modules, then heat transfer efficiency is improved, but assembly complexity increases
Solution Approach 1:
Multiple heatsinks and memory modules are pre-assembled into a integrated unit with a common cold plate interface. This merging of components simplifies the final assembly process, as the entire assembly can be installed as a single unit rather than requiring separate attachment of each heatsink, thus reducing assembly complexity while maintaining heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the disadvantages of memory cooling by allowing simultaneous insertion of memory modules with heatsinks and a cold plate, enhancing heat transfer and airflow, thereby improving cooling efficiency.
Implementation Method 1
a cold plate having projections that extend into regions between adjacent ones of the plurality of heatsinks
Implementation Method 2
enhancing heat transfer and airflow, thereby improving cooling efficiency
Data Source
AI summary
An information handling system may include a circuit board that includes a plurality of memory module sockets; a plurality of memory modules received in the plurality of memory module sockets; a plurality of heatsinks disposed between adjacent ones of the plurality of memory modules; and a cold plate having projections that extend into regions between adjacent ones of the plurality of heatsinks.