Conformal Moisture Barrier for Surgical Instrument PCBs

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Solution Overview

Problem

The harsh conditions of sterilization processes degrade electrical components in surgical instruments, such as endoscopes, affecting their performance and shortening their useful life.

Innovation Solution

An electronic assembly comprising a printed circuit board (PCB), an electrical component attached to the PCB, and a conformal barrier with a first barrier layer of atomic layer deposited (ALD) film and a second barrier layer of Parylene, providing protection against moisture and sterilization processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If surgical instruments undergo sterilization processes including chemical baths, ultrasonic agitation, and high autoclave temperatures, then sterilization is achieved, but electrical components are degraded and useful life is shortened

Engineering Contradiction:
Improvesterilization effectivenessVSAvoiduseful life of surgical instruments
Core Design Contradiction:
ReliabilityVSDuration of action of stationary object

Solution Approach 1:

A conformal barrier coating is applied to electrical components before sterilization processes. This preliminary protective layer prevents direct exposure to harsh sterilization conditions (chemical baths, ultrasonic agitation, high temperatures), thereby preserving component integrity and extending useful life while maintaining sterilization effectiveness

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The conformal barrier coating acts as an intermediary between the electrical components and the harsh sterilization environment. This intermediate layer shields sensitive electronic parts from direct contact with degrading factors while allowing the sterilization process to proceed effectively on other instrument surfaces

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If conventional coating materials are used on electrical components, then ease of manufacture is improved, but the coating degrades during autoclave sterilization and component performance deteriorates

Engineering Contradiction:
Improvecoating application simplicityVSAvoidcomponent performance under sterilization
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent employs a composite coating structure consisting of multiple layers with different properties. This multi-layer conformal barrier combines materials that collectively provide both ease of manufacture and superior resistance to autoclave sterilization, preventing degradation and maintaining component performance

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The conformal barrier effectively protects the PCB and electrical components from moisture and sterilization damage, ensuring reliable operation and extending the useful life of surgical instruments.

Implementation Method 1

forming, by atomic layer deposition, a first barrier layer on at least a portion of a surface of a PCB and on an outer surface of an electrical component

Methodology Applied
Scientific EffectAtomic layer deposition: Physical Vapour Deposition

Implementation Method 2

forming, on the first barrier layer, a second barrier layer comprising Parylene

Methodology Applied
Scientific EffectParylene deposition: Chemical Vapour Deposition

Data Source

PatentUS20250185894A1Electronic assemblies including a conformal moisture barrier
Publication Date: 2025.06.12 INTUITIVE SURGICAL OPERATIONS INC
  • US20250185894A1 patent drawing
  • US20250185894A1 patent drawing
  • US20250185894A1 patent drawing

AI summary

A method includes forming, by atomic layer deposition, a first barrier layer on a surface of a printed circuit board (“PCB”) and on an outer surface of an electrical component attached to the surface of the PCB; forming an adhesion promotion layer on a surface of the first barrier layer; and forming, on the adhesion promotion layer, a second barrier layer including Parylene.